Tensile Behavior of Single-Crystal Tin Whiskers

The growth of metallic (predominantly Sn) whiskers from pure metallic platings has been studied for over 50 years. While the phenomenon of Sn whiskering has been studied for decades, very little is known about the mechanical properties of these materials. This can be attributed to the difficulty in...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Journal of electronic materials 2014-04, Vol.43 (4), p.978-982
Hauptverfasser:	Singh, S.S., Sarkar, R., Xie, H.-X., Mayer, C., Rajagopalan, J., Chawla, N.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Brief Communication Characterization and Evaluation of Materials Chemistry and Materials Science Condensed matter: structure, mechanical and thermal properties Cross-disciplinary physics: materials science rheology Elasticity. Plasticity Electronics Electronics and Microelectronics Exact sciences and technology Fractures Instrumentation Materials Science Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Metals. Metallurgy Methods of crystal growth physics of crystal growth Optical and Electronic Materials Physics Single crystals Solid State Physics Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Tensile strength Theory and models of crystal growth physics of crystal growth, crystal morphology and orientation Tin Whiskers and dendrites (growth, structure, and nonelectronic properties)
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!