Displacement-Type Solder Plating for SMT Board

The higherdensities and fine pitch patters of recent printed circuit boards market, it is troublesome to prepare an adequate solder layer using such conventional mounting technologies as hot air leveling and solder paste treatment. Thus a new displacement-type plating process have been developed app...

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Veröffentlicht in:	Hyōmen gijutsu 1993/12/01, Vol.44(12), pp.1158-1163
Hauptverfasser:	KUBO, Motonobu, KAMITAMARI, Tohru, HOTTA, Teruyuki, KISO, Masayuki, UCHIDA, Hiroki, OHTAKA, Tetsuo
Format:	Artikel
Sprache:	eng
Schlagworte:	Displacement-Type Solder Plating Surface-Mount Technology
Online-Zugang:	Volltext
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