Displacement-Type Solder Plating for SMT Board

Displacement-Type Solder Plating for SMT Board

The higherdensities and fine pitch patters of recent printed circuit boards market, it is troublesome to prepare an adequate solder layer using such conventional mounting technologies as hot air leveling and solder paste treatment. Thus a new displacement-type plating process have been developed app...

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Veröffentlicht in:Hyōmen gijutsu 1993/12/01, Vol.44(12), pp.1158-1163
Hauptverfasser: KUBO, Motonobu, KAMITAMARI, Tohru, HOTTA, Teruyuki, KISO, Masayuki, UCHIDA, Hiroki, OHTAKA, Tetsuo
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Sprache:eng
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Displacement-Type
Solder Plating
Surface-Mount Technology
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container_end_page 1163
container_issue 12
container_start_page 1158
container_title Hyōmen gijutsu
container_volume 44
creator KUBO, Motonobu
KAMITAMARI, Tohru
HOTTA, Teruyuki
KISO, Masayuki
UCHIDA, Hiroki
OHTAKA, Tetsuo
description The higherdensities and fine pitch patters of recent printed circuit boards market, it is troublesome to prepare an adequate solder layer using such conventional mounting technologies as hot air leveling and solder paste treatment. Thus a new displacement-type plating process have been developed apply a thick layer of Pb-Sn alloy on PCBs having fine pitch patterns, as thicknesses of 10μm have been deposited within ca. 13 minutes The new deposit was resistant to oxidation, and its solderability after heattreatment at 200°C for 10 minutes was superior to that of layers made by conventional technique.
doi_str_mv 10.4139/sfj.44.1158
format Article
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subjects Displacement-Type
Solder Plating
Surface-Mount Technology
title Displacement-Type Solder Plating for SMT Board
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