Investigation of High-Strength Electroformed Ni for Microprobes
We have developed a microprobe that achieves low contact resistance under low contact force only for gold pads. However, in the case of Al pads, an oxide layer formed on the aluminum pad surface obstructs stable contacting, so higher contact force with a strong probe is required. The present study a...
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| Veröffentlicht in: | JSME International Journal Series A Solid Mechanics and Material Engineering 2006, Vol.49(1), pp.79-84 |
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| container_title | JSME International Journal Series A Solid Mechanics and Material Engineering |
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| creator | KIMURA, Teppei ARITA, Naoki FUKINBARA, Hajime HATTORI, Tadashi |
| description | We have developed a microprobe that achieves low contact resistance under low contact force only for gold pads. However, in the case of Al pads, an oxide layer formed on the aluminum pad surface obstructs stable contacting, so higher contact force with a strong probe is required. The present study attempts to enhance the strength of the probe material by improving its mechanical properties. It is said that grain downsizing, functionally alloying, or impurity addition can increase material strength. Our study has adopted impurity addition to the electroforming bath because the process can be controlled. Thus, high-strength electroformed Ni has successfully been obtained. Improved Ni has a high Vickers hardness of Hv600 compared with Hv450 for conventional nickel, and a high Young’s modulus of E=200GPa compared with E=150GPa for conventional nickel. |
| doi_str_mv | 10.1299/jsmea.49.79 |
| format | Article |
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However, in the case of Al pads, an oxide layer formed on the aluminum pad surface obstructs stable contacting, so higher contact force with a strong probe is required. The present study attempts to enhance the strength of the probe material by improving its mechanical properties. It is said that grain downsizing, functionally alloying, or impurity addition can increase material strength. Our study has adopted impurity addition to the electroforming bath because the process can be controlled. Thus, high-strength electroformed Ni has successfully been obtained. Improved Ni has a high Vickers hardness of Hv600 compared with Hv450 for conventional nickel, and a high Young’s modulus of E=200GPa compared with E=150GPa for conventional nickel.</description><identifier>ISSN: 1344-7912</identifier><identifier>EISSN: 1347-5363</identifier><identifier>DOI: 10.1299/jsmea.49.79</identifier><language>eng</language><publisher>Tokyo: The Japan Society of Mechanical Engineers</publisher><subject>Electroforming ; Grain Size ; Sodium Allylsulfonate</subject><ispartof>JSME International Journal Series A Solid Mechanics and Material Engineering, 2006, Vol.49(1), pp.79-84</ispartof><rights>2006 by The Japan Society of Mechanical Engineers</rights><rights>Copyright Japan Science and Technology Agency 2006</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c461t-a63a8cc72a6f2edac5925eaa3292f0bf48e2ff8048abf677069f509a963798023</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,1877,27901,27902</link.rule.ids></links><search><creatorcontrib>KIMURA, Teppei</creatorcontrib><creatorcontrib>ARITA, Naoki</creatorcontrib><creatorcontrib>FUKINBARA, Hajime</creatorcontrib><creatorcontrib>HATTORI, Tadashi</creatorcontrib><title>Investigation of High-Strength Electroformed Ni for Microprobes</title><title>JSME International Journal Series A Solid Mechanics and Material Engineering</title><description>We have developed a microprobe that achieves low contact resistance under low contact force only for gold pads. However, in the case of Al pads, an oxide layer formed on the aluminum pad surface obstructs stable contacting, so higher contact force with a strong probe is required. The present study attempts to enhance the strength of the probe material by improving its mechanical properties. It is said that grain downsizing, functionally alloying, or impurity addition can increase material strength. Our study has adopted impurity addition to the electroforming bath because the process can be controlled. Thus, high-strength electroformed Ni has successfully been obtained. 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| identifier | ISSN: 1344-7912 |
| ispartof | JSME International Journal Series A Solid Mechanics and Material Engineering, 2006, Vol.49(1), pp.79-84 |
| issn | 1344-7912 1347-5363 |
| language | eng |
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| source | J-STAGE (Japan Science & Technology Information Aggregator, Electronic) Freely Available Titles - Japanese; Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals |
| subjects | Electroforming Grain Size Sodium Allylsulfonate |
| title | Investigation of High-Strength Electroformed Ni for Microprobes |
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