Brazing Inconel 625 Using the Copper Foil
Brazing Inconel 625 (IN-625) using the copper foil has been investigated in this research. The brazed joint is composed of nanosized CrNi 3 precipitates and Cr/Mo/Nb/Ni quaternary compound in the Cu/Ni-rich matrix. The copper filler 50 μ m in thickness is enough for the joint filling. However, the a...
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| Veröffentlicht in: | Metallurgical and materials transactions. A, Physical metallurgy and materials science Physical metallurgy and materials science, 2013-12, Vol.44 (13), p.5724-5731 |
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| container_title | Metallurgical and materials transactions. A, Physical metallurgy and materials science |
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| creator | Chen, Wen-Shiang Wang, Cheng-Yen Shiue, Ren-Kae |
| description | Brazing Inconel 625 (IN-625) using the copper foil has been investigated in this research. The brazed joint is composed of nanosized CrNi
3
precipitates and Cr/Mo/Nb/Ni quaternary compound in the Cu/Ni-rich matrix. The copper filler 50
μ
m in thickness is enough for the joint filling. However, the application of Cu foil 100
μ
m in thickness has little effect on the shear strength of the brazed joint. The specimen brazed at 1433 K (1160 °C) for 1800 seconds demonstrates the best shear strength of 470 MPa, and its fractograph is dominated by ductile dimple fracture with sliding marks. Decreasing the brazing temperature slightly decreases the shear strength of the brazed joint due to the presence of a few isolated solidification shrinkage voids smaller than 15
μ
m. Increasing the brazing temperature, especially for the specimen brazed at 1473 K (1200 °C), significantly deteriorates the shear strength of the joint below 260 MPa because of coalescence of isothermal solidification shrinkage voids in the joint. The Cu foil demonstrates potential in brazing IN-625 for industrial application. |
| doi_str_mv | 10.1007/s11661-013-1954-x |
| format | Article |
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3
precipitates and Cr/Mo/Nb/Ni quaternary compound in the Cu/Ni-rich matrix. The copper filler 50
μ
m in thickness is enough for the joint filling. However, the application of Cu foil 100
μ
m in thickness has little effect on the shear strength of the brazed joint. The specimen brazed at 1433 K (1160 °C) for 1800 seconds demonstrates the best shear strength of 470 MPa, and its fractograph is dominated by ductile dimple fracture with sliding marks. Decreasing the brazing temperature slightly decreases the shear strength of the brazed joint due to the presence of a few isolated solidification shrinkage voids smaller than 15
μ
m. Increasing the brazing temperature, especially for the specimen brazed at 1473 K (1200 °C), significantly deteriorates the shear strength of the joint below 260 MPa because of coalescence of isothermal solidification shrinkage voids in the joint. The Cu foil demonstrates potential in brazing IN-625 for industrial application.</description><identifier>ISSN: 1073-5623</identifier><identifier>EISSN: 1543-1940</identifier><identifier>DOI: 10.1007/s11661-013-1954-x</identifier><identifier>CODEN: MMTAEB</identifier><language>eng</language><publisher>Boston: Springer US</publisher><subject>Applied sciences ; Brazing ; Brazing. Soldering ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Copper ; Exact sciences and technology ; Foil bearings ; Joining, thermal cutting: metallurgical aspects ; Materials Science ; Metallic Materials ; Metals. Metallurgy ; Nanotechnology ; Structural Materials ; Surfaces and Interfaces ; Thin Films</subject><ispartof>Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2013-12, Vol.44 (13), p.5724-5731</ispartof><rights>The Minerals, Metals & Materials Society and ASM International 2013</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c346t-1677d1501838f7c8923fd91c36a755ec67df5b94c21159f60ef12034d86c8dd63</citedby><cites>FETCH-LOGICAL-c346t-1677d1501838f7c8923fd91c36a755ec67df5b94c21159f60ef12034d86c8dd63</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s11661-013-1954-x$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s11661-013-1954-x$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,41488,42557,51319</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=28028738$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Chen, Wen-Shiang</creatorcontrib><creatorcontrib>Wang, Cheng-Yen</creatorcontrib><creatorcontrib>Shiue, Ren-Kae</creatorcontrib><title>Brazing Inconel 625 Using the Copper Foil</title><title>Metallurgical and materials transactions. A, Physical metallurgy and materials science</title><addtitle>Metall Mater Trans A</addtitle><description>Brazing Inconel 625 (IN-625) using the copper foil has been investigated in this research. The brazed joint is composed of nanosized CrNi
3
precipitates and Cr/Mo/Nb/Ni quaternary compound in the Cu/Ni-rich matrix. The copper filler 50
μ
m in thickness is enough for the joint filling. However, the application of Cu foil 100
μ
m in thickness has little effect on the shear strength of the brazed joint. The specimen brazed at 1433 K (1160 °C) for 1800 seconds demonstrates the best shear strength of 470 MPa, and its fractograph is dominated by ductile dimple fracture with sliding marks. Decreasing the brazing temperature slightly decreases the shear strength of the brazed joint due to the presence of a few isolated solidification shrinkage voids smaller than 15
μ
m. Increasing the brazing temperature, especially for the specimen brazed at 1473 K (1200 °C), significantly deteriorates the shear strength of the joint below 260 MPa because of coalescence of isothermal solidification shrinkage voids in the joint. The Cu foil demonstrates potential in brazing IN-625 for industrial application.</description><subject>Applied sciences</subject><subject>Brazing</subject><subject>Brazing. Soldering</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Copper</subject><subject>Exact sciences and technology</subject><subject>Foil bearings</subject><subject>Joining, thermal cutting: metallurgical aspects</subject><subject>Materials Science</subject><subject>Metallic Materials</subject><subject>Metals. Metallurgy</subject><subject>Nanotechnology</subject><subject>Structural Materials</subject><subject>Surfaces and Interfaces</subject><subject>Thin Films</subject><issn>1073-5623</issn><issn>1543-1940</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNp1kE1LAzEQhoMoWKs_wNuCePAQzeR7j1qsFgpe7DnEbFK3rLtr0kL115tli3jxNF_vvDM8CF0CuQVC1F0CkBIwAYahFBzvj9AEBB8qTo5zThTDQlJ2is5S2hBCoGRygm4eov2u23WxaF3X-qaQVBSrNHS2776YdX3vYzHv6uYcnQTbJH9xiFO0mj--zp7x8uVpMbtfYse43GKQSlUgCGimg3K6pCxUJTgmrRLCO6mqIN5K7iiAKIMkPgAljFdaOl1Vkk3R1ejbx-5z59PWbLpdbPNJA1yCEpoLmlUwqlzsUoo-mD7WHzZ-GSBmIGJGIiYTMQMRs8871wdnm5xtQrStq9PvItWEasV01tFRl_KoXfv454N_zX8AIUhtMg</recordid><startdate>20131201</startdate><enddate>20131201</enddate><creator>Chen, Wen-Shiang</creator><creator>Wang, Cheng-Yen</creator><creator>Shiue, Ren-Kae</creator><general>Springer US</general><general>Springer</general><general>Springer Nature B.V</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>4T-</scope><scope>4U-</scope><scope>7SR</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8AO</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope></search><sort><creationdate>20131201</creationdate><title>Brazing Inconel 625 Using the Copper Foil</title><author>Chen, Wen-Shiang ; Wang, Cheng-Yen ; Shiue, Ren-Kae</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c346t-1677d1501838f7c8923fd91c36a755ec67df5b94c21159f60ef12034d86c8dd63</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Applied sciences</topic><topic>Brazing</topic><topic>Brazing. Soldering</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Copper</topic><topic>Exact sciences and technology</topic><topic>Foil bearings</topic><topic>Joining, thermal cutting: metallurgical aspects</topic><topic>Materials Science</topic><topic>Metallic Materials</topic><topic>Metals. Metallurgy</topic><topic>Nanotechnology</topic><topic>Structural Materials</topic><topic>Surfaces and Interfaces</topic><topic>Thin Films</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chen, Wen-Shiang</creatorcontrib><creatorcontrib>Wang, Cheng-Yen</creatorcontrib><creatorcontrib>Shiue, Ren-Kae</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>Docstoc</collection><collection>University Readers</collection><collection>Engineered Materials Abstracts</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library</collection><collection>Science Database</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><jtitle>Metallurgical and materials transactions. A, Physical metallurgy and materials science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Chen, Wen-Shiang</au><au>Wang, Cheng-Yen</au><au>Shiue, Ren-Kae</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Brazing Inconel 625 Using the Copper Foil</atitle><jtitle>Metallurgical and materials transactions. A, Physical metallurgy and materials science</jtitle><stitle>Metall Mater Trans A</stitle><date>2013-12-01</date><risdate>2013</risdate><volume>44</volume><issue>13</issue><spage>5724</spage><epage>5731</epage><pages>5724-5731</pages><issn>1073-5623</issn><eissn>1543-1940</eissn><coden>MMTAEB</coden><abstract>Brazing Inconel 625 (IN-625) using the copper foil has been investigated in this research. The brazed joint is composed of nanosized CrNi
3
precipitates and Cr/Mo/Nb/Ni quaternary compound in the Cu/Ni-rich matrix. The copper filler 50
μ
m in thickness is enough for the joint filling. However, the application of Cu foil 100
μ
m in thickness has little effect on the shear strength of the brazed joint. The specimen brazed at 1433 K (1160 °C) for 1800 seconds demonstrates the best shear strength of 470 MPa, and its fractograph is dominated by ductile dimple fracture with sliding marks. Decreasing the brazing temperature slightly decreases the shear strength of the brazed joint due to the presence of a few isolated solidification shrinkage voids smaller than 15
μ
m. Increasing the brazing temperature, especially for the specimen brazed at 1473 K (1200 °C), significantly deteriorates the shear strength of the joint below 260 MPa because of coalescence of isothermal solidification shrinkage voids in the joint. The Cu foil demonstrates potential in brazing IN-625 for industrial application.</abstract><cop>Boston</cop><pub>Springer US</pub><doi>10.1007/s11661-013-1954-x</doi><tpages>8</tpages></addata></record> |
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| subjects | Applied sciences Brazing Brazing. Soldering Characterization and Evaluation of Materials Chemistry and Materials Science Copper Exact sciences and technology Foil bearings Joining, thermal cutting: metallurgical aspects Materials Science Metallic Materials Metals. Metallurgy Nanotechnology Structural Materials Surfaces and Interfaces Thin Films |
| title | Brazing Inconel 625 Using the Copper Foil |
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