Dependence of De-molding Force on Process Conditions in UV Nanoimprint

Dependence of De-molding Force on Process Conditions in UV Nanoimprint

The de-molding force between a UV resist and a Si dioxide surface is measured for various UV light intensities and exposure times. Typical UV radical polymerization resists are examined without any surface treatment of the Si dioxide surface for releasing. The result shows that the de-molding force...

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Veröffentlicht in:Journal of Photopolymer Science and Technology 2011/06/21, Vol.24(1), pp.101-104
Hauptverfasser: Nishino, Tomoki, Suzuki, Ryosuke, Kawata, Hiroaki, Hirai, Yoshiaki
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Sprache:eng
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de-molding force
dosage
light intensity
UV curable resist
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container_issue 1
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container_title Journal of Photopolymer Science and Technology
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creator Nishino, Tomoki
Suzuki, Ryosuke
Kawata, Hiroaki
Hirai, Yoshiaki
description The de-molding force between a UV resist and a Si dioxide surface is measured for various UV light intensities and exposure times. Typical UV radical polymerization resists are examined without any surface treatment of the Si dioxide surface for releasing. The result shows that the de-molding force increases in as increments of the UV light intensity, however it does not depend on the UV dosage. But the de-molding force depends on the product of the square root of the light intensity and exposure time, which is nearly consistent with the UV curing characteristics of the polymer.
doi_str_mv 10.2494/photopolymer.24.101
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subjects de-molding force
dosage
light intensity
UV curable resist
title Dependence of De-molding Force on Process Conditions in UV Nanoimprint
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