193 nm Immersion Lithography - Taking The Plunge
This paper reviews the current status and future outlook of materials for 193 nm immersion lithography, with special focus on top barrier layers, photoresists, bottom antireflective coatings for numerical apertures exceeding unity, and future challenges for imaging materials along the Roadmap.
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| Veröffentlicht in: | Journal of Photopolymer Science and Technology 2004, Vol.17(4), pp.587-601 |
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| container_end_page | 601 |
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| container_issue | 4 |
| container_start_page | 587 |
| container_title | Journal of Photopolymer Science and Technology |
| container_volume | 17 |
| creator | Dammel, Ralph Houlihan, Frank M. Sakamuri, Raj Rentkiewicz, David Romano, Andrew |
| description | This paper reviews the current status and future outlook of materials for 193 nm immersion lithography, with special focus on top barrier layers, photoresists, bottom antireflective coatings for numerical apertures exceeding unity, and future challenges for imaging materials along the Roadmap. |
| doi_str_mv | 10.2494/photopolymer.17.587 |
| format | Article |
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| fulltext | fulltext |
| identifier | ISSN: 0914-9244 |
| ispartof | Journal of Photopolymer Science and Technology, 2004, Vol.17(4), pp.587-601 |
| issn | 0914-9244 1349-6336 |
| language | eng |
| recordid | cdi_proquest_journals_1444631746 |
| source | J-STAGE Free; EZB-FREE-00999 freely available EZB journals; Free Full-Text Journals in Chemistry |
| subjects | 193 nm lithography antireflecting coating flavored water immersion lithography |
| title | 193 nm Immersion Lithography - Taking The Plunge |
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