Summary of Existing Models of the Ni-P Coating Electroless Deposition Process
ABSTRACT Electroless nickel‐phosphorous plating is a technique often employed in preparation of protective, decorative, and functional coatings. Several feasible mechanisms are discussed in the literature. The influence of process parameters on metal coating deposition is analyzed and described. Nev...
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Veröffentlicht in: | International journal of chemical kinetics 2013-11, Vol.45 (11), p.755-762 |
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container_title | International journal of chemical kinetics |
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creator | Stankiewicz, A. Szczygieł, I. Szczygieł, B. |
description | ABSTRACT
Electroless nickel‐phosphorous plating is a technique often employed in preparation of protective, decorative, and functional coatings. Several feasible mechanisms are discussed in the literature. The influence of process parameters on metal coating deposition is analyzed and described. Nevertheless, some basics of the process and the fundamental aspects of plating still not explained. A number of research groups make an effort to provide a description of the process with a physical model. The aim is to design a theoretical model that could be valid under operating conditions on a practical scale. This work gives a short review of the published data on the mechanism and kinetics of the electroless Ni‐P deposition process. The review also touches a novel approach—proposition to analyze data using artificial intelligence tools. |
doi_str_mv | 10.1002/kin.20810 |
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Electroless nickel‐phosphorous plating is a technique often employed in preparation of protective, decorative, and functional coatings. Several feasible mechanisms are discussed in the literature. The influence of process parameters on metal coating deposition is analyzed and described. Nevertheless, some basics of the process and the fundamental aspects of plating still not explained. A number of research groups make an effort to provide a description of the process with a physical model. The aim is to design a theoretical model that could be valid under operating conditions on a practical scale. This work gives a short review of the published data on the mechanism and kinetics of the electroless Ni‐P deposition process. The review also touches a novel approach—proposition to analyze data using artificial intelligence tools.</description><identifier>ISSN: 0538-8066</identifier><identifier>EISSN: 1097-4601</identifier><identifier>DOI: 10.1002/kin.20810</identifier><identifier>CODEN: IJCKBO</identifier><language>eng</language><publisher>Hoboken: Blackwell Publishing Ltd</publisher><subject>Artificial intelligence ; Studies</subject><ispartof>International journal of chemical kinetics, 2013-11, Vol.45 (11), p.755-762</ispartof><rights>2013 Wiley Periodicals, Inc.</rights><rights>Copyright © 2013 Wiley Periodicals, Inc.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c3350-8c1222a6cde07b24cb5e61754797c25b65f725bd9bf908232565be82091250163</citedby><cites>FETCH-LOGICAL-c3350-8c1222a6cde07b24cb5e61754797c25b65f725bd9bf908232565be82091250163</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1002%2Fkin.20810$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1002%2Fkin.20810$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,776,780,1411,27901,27902,45550,45551</link.rule.ids></links><search><creatorcontrib>Stankiewicz, A.</creatorcontrib><creatorcontrib>Szczygieł, I.</creatorcontrib><creatorcontrib>Szczygieł, B.</creatorcontrib><title>Summary of Existing Models of the Ni-P Coating Electroless Deposition Process</title><title>International journal of chemical kinetics</title><addtitle>Int. J. Chem. Kinet</addtitle><description>ABSTRACT
Electroless nickel‐phosphorous plating is a technique often employed in preparation of protective, decorative, and functional coatings. Several feasible mechanisms are discussed in the literature. The influence of process parameters on metal coating deposition is analyzed and described. Nevertheless, some basics of the process and the fundamental aspects of plating still not explained. A number of research groups make an effort to provide a description of the process with a physical model. The aim is to design a theoretical model that could be valid under operating conditions on a practical scale. This work gives a short review of the published data on the mechanism and kinetics of the electroless Ni‐P deposition process. The review also touches a novel approach—proposition to analyze data using artificial intelligence tools.</description><subject>Artificial intelligence</subject><subject>Studies</subject><issn>0538-8066</issn><issn>1097-4601</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNp1kEtPwzAQhC0EEqVw4B9E4sQh7dqO7eSISltKH1Q81KOVuA6kTeNip6L99yQNcOM00uw3u9pB6BpDBwOQ7jorOgRCDCeohSESfsABn6IWMBr6IXB-ji6cWwFAFGHWQtOX3WYT24NnUq-_z1yZFe_e1Cx17mqr_NDeLPPnXs_Ex1E_16q0JtfOefd6a1xWZqbw5taoyrpEZ2mcO331o230Nui_9h78ydNw1Lub-IpSBn6oMCEk5mqpQSQkUAnTHAsWiEgowhLOUlHJMkrSCEJCCeMs0SGBCBMGmNM2umn2bq353GlXypXZ2aI6KXFABeGMkZq6bShljXNWp3Jrs_pZiUHWbcmqLXlsq2K7DfuV5frwPyjHo9lvwm8SVWl6_5eI7VpyQQWTi9lQPgfR_WM4XsgB_QaPrHhs</recordid><startdate>201311</startdate><enddate>201311</enddate><creator>Stankiewicz, A.</creator><creator>Szczygieł, I.</creator><creator>Szczygieł, B.</creator><general>Blackwell Publishing Ltd</general><general>Wiley Subscription Services, Inc</general><scope>BSCLL</scope><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>201311</creationdate><title>Summary of Existing Models of the Ni-P Coating Electroless Deposition Process</title><author>Stankiewicz, A. ; Szczygieł, I. ; Szczygieł, B.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c3350-8c1222a6cde07b24cb5e61754797c25b65f725bd9bf908232565be82091250163</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Artificial intelligence</topic><topic>Studies</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Stankiewicz, A.</creatorcontrib><creatorcontrib>Szczygieł, I.</creatorcontrib><creatorcontrib>Szczygieł, B.</creatorcontrib><collection>Istex</collection><collection>CrossRef</collection><jtitle>International journal of chemical kinetics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Stankiewicz, A.</au><au>Szczygieł, I.</au><au>Szczygieł, B.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Summary of Existing Models of the Ni-P Coating Electroless Deposition Process</atitle><jtitle>International journal of chemical kinetics</jtitle><addtitle>Int. J. Chem. Kinet</addtitle><date>2013-11</date><risdate>2013</risdate><volume>45</volume><issue>11</issue><spage>755</spage><epage>762</epage><pages>755-762</pages><issn>0538-8066</issn><eissn>1097-4601</eissn><coden>IJCKBO</coden><abstract>ABSTRACT
Electroless nickel‐phosphorous plating is a technique often employed in preparation of protective, decorative, and functional coatings. Several feasible mechanisms are discussed in the literature. The influence of process parameters on metal coating deposition is analyzed and described. Nevertheless, some basics of the process and the fundamental aspects of plating still not explained. A number of research groups make an effort to provide a description of the process with a physical model. The aim is to design a theoretical model that could be valid under operating conditions on a practical scale. This work gives a short review of the published data on the mechanism and kinetics of the electroless Ni‐P deposition process. The review also touches a novel approach—proposition to analyze data using artificial intelligence tools.</abstract><cop>Hoboken</cop><pub>Blackwell Publishing Ltd</pub><doi>10.1002/kin.20810</doi><tpages>8</tpages></addata></record> |
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title | Summary of Existing Models of the Ni-P Coating Electroless Deposition Process |
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