Copper Wire Bonding Concerns and Best Practices

Copper wire bonding of microelectronic parts has developed as a means to cut the costs of using the more mature technology of gold wire bonding. However, with this new technology, changes in the bonding processes as well as bonding metallurgy can affect product reliability. This paper discusses the challenges associated with copper wire bonding and the solutions that the industry has been implementing. The paper also provides information to enable customers to conduct qualification and reliability tests on microelectronic packages to facilitate adoption in their target applications.