Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates

A lead-free glass frit paste as a die-attach material for high-temperature microelectronic application is proposed in this study. The glass paste containing Bi-based powder with a moderate amount of solvent was used for joining Si dice on ceramic substrates without any metallization preparation for...

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Veröffentlicht in:	Journal of electronic materials 2013-08, Vol.42 (8), p.2667-2676
Hauptverfasser:	Sharif, Ahmed, Lim, Jun zhang, Made, Riko I, Lau, Fu Long, Phua, Eric Jian Rong, Lim, Ju Dy, Wong, Chee Cheong, Gan, Chee Lip, Chen, Zhong
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Ceramics Characterization and Evaluation of Materials Chemistry and Materials Science Condensed matter: structure, mechanical and thermal properties Electronics Electronics and Microelectronics Exact sciences and technology Glass High temperature Instrumentation Materials Science Mechanical and acoustical properties Metals Microelectronic fabrication (materials and surfaces technology) Optical and Electronic Materials Physical properties of thin films, nonelectronic Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Solid State Physics Structure and morphology thickness Substrates Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thin film structure and morphology
Online-Zugang:	Volltext
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