Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates
A lead-free glass frit paste as a die-attach material for high-temperature microelectronic application is proposed in this study. The glass paste containing Bi-based powder with a moderate amount of solvent was used for joining Si dice on ceramic substrates without any metallization preparation for...
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| Veröffentlicht in: | Journal of electronic materials 2013-08, Vol.42 (8), p.2667-2676 |
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| creator | Sharif, Ahmed Lim, Jun zhang Made, Riko I Lau, Fu Long Phua, Eric Jian Rong Lim, Ju Dy Wong, Chee Cheong Gan, Chee Lip Chen, Zhong |
| description | A lead-free glass frit paste as a die-attach material for high-temperature microelectronic application is proposed in this study. The glass paste containing Bi-based powder with a moderate amount of solvent was used for joining Si dice on ceramic substrates without any metallization preparation for either of the bonding surfaces. The die was bonded to a ceramic substrate at 430°C for 10 min. The study focuses on the mechanical and microstructural characterization of the joints with Si dice on two different types of ceramic substrate. Shear strength measurements were carried out at both ambient and 250°C to evaluate room- and high-temperature performance. Furthermore, the effect of aging at 300°C for 500 h on the mechanical properties is presented. The results of the mechanical and microstructural characterization demonstrate that low-temperature glass frit bonding is an effective die-attach method for harsh-environment electronic packaging. |
| doi_str_mv | 10.1007/s11664-013-2613-0 |
| format | Article |
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The glass paste containing Bi-based powder with a moderate amount of solvent was used for joining Si dice on ceramic substrates without any metallization preparation for either of the bonding surfaces. The die was bonded to a ceramic substrate at 430°C for 10 min. The study focuses on the mechanical and microstructural characterization of the joints with Si dice on two different types of ceramic substrate. Shear strength measurements were carried out at both ambient and 250°C to evaluate room- and high-temperature performance. Furthermore, the effect of aging at 300°C for 500 h on the mechanical properties is presented. The results of the mechanical and microstructural characterization demonstrate that low-temperature glass frit bonding is an effective die-attach method for harsh-environment electronic packaging.</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-013-2613-0</identifier><identifier>CODEN: JECMA5</identifier><language>eng</language><publisher>Boston: Springer US</publisher><subject>Applied sciences ; Ceramics ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Condensed matter: structure, mechanical and thermal properties ; Electronics ; Electronics and Microelectronics ; Exact sciences and technology ; Glass ; High temperature ; Instrumentation ; Materials Science ; Mechanical and acoustical properties ; Metals ; Microelectronic fabrication (materials and surfaces technology) ; Optical and Electronic Materials ; Physical properties of thin films, nonelectronic ; Physics ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Solid State Physics ; Structure and morphology; thickness ; Substrates ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) ; Thin film structure and morphology</subject><ispartof>Journal of electronic materials, 2013-08, Vol.42 (8), p.2667-2676</ispartof><rights>TMS 2013</rights><rights>2014 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c346t-c87ed5ea2215eabc409be258050a7ae12a477f448002a682fc784f34143caa583</citedby><cites>FETCH-LOGICAL-c346t-c87ed5ea2215eabc409be258050a7ae12a477f448002a682fc784f34143caa583</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s11664-013-2613-0$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s11664-013-2613-0$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,776,780,27901,27902,41464,42533,51294</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=27637173$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Sharif, Ahmed</creatorcontrib><creatorcontrib>Lim, Jun zhang</creatorcontrib><creatorcontrib>Made, Riko I</creatorcontrib><creatorcontrib>Lau, Fu Long</creatorcontrib><creatorcontrib>Phua, Eric Jian Rong</creatorcontrib><creatorcontrib>Lim, Ju Dy</creatorcontrib><creatorcontrib>Wong, Chee Cheong</creatorcontrib><creatorcontrib>Gan, Chee Lip</creatorcontrib><creatorcontrib>Chen, Zhong</creatorcontrib><title>Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates</title><title>Journal of electronic materials</title><addtitle>Journal of Elec Materi</addtitle><description>A lead-free glass frit paste as a die-attach material for high-temperature microelectronic application is proposed in this study. The glass paste containing Bi-based powder with a moderate amount of solvent was used for joining Si dice on ceramic substrates without any metallization preparation for either of the bonding surfaces. The die was bonded to a ceramic substrate at 430°C for 10 min. The study focuses on the mechanical and microstructural characterization of the joints with Si dice on two different types of ceramic substrate. Shear strength measurements were carried out at both ambient and 250°C to evaluate room- and high-temperature performance. Furthermore, the effect of aging at 300°C for 500 h on the mechanical properties is presented. The results of the mechanical and microstructural characterization demonstrate that low-temperature glass frit bonding is an effective die-attach method for harsh-environment electronic packaging.</description><subject>Applied sciences</subject><subject>Ceramics</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Electronics</subject><subject>Electronics and Microelectronics</subject><subject>Exact sciences and technology</subject><subject>Glass</subject><subject>High temperature</subject><subject>Instrumentation</subject><subject>Materials Science</subject><subject>Mechanical and acoustical properties</subject><subject>Metals</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Optical and Electronic Materials</subject><subject>Physical properties of thin films, nonelectronic</subject><subject>Physics</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Solid State Physics</subject><subject>Structure and morphology; thickness</subject><subject>Substrates</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><subject>Thin film structure and morphology</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>BENPR</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNp1kF9LHTEQxUOp0Fv1A_gWKH2MZpLsJu3b5frnCoqCCr6FuemsruzdXZMs1H765nal9KUwzEDmd86Ew9gRyGOQ0p4kgLo2QoIWqi5NfmALqIwW4OrHj2whdQ2iUrr6xD6n9CIlVOBgwX7ebsR5JOIXHabEbzFl-s6X_Joydl37C3M79DNx2pJY5ozheUt95ndDN-2WvBkiX7dPz-KetiNFzFMkvhzHrg1_1LzUqrxv28Dvpk3KBaF0wPYa7BIdvs999nB-dr9ai6ubi8vV8koEbeosgrP0oyJUCkrfBCO_bUhVTlYSLRIoNNY2xjgpFdZONcE602gDRgfEyul99mX2HePwOlHK_mWYYl9OejBSG2fAmkLBTIU4pBSp8WNstxjfPEi_C9jPAfsSsN8F7GXRfH13xhSwayL2oU1_hcrW2oLVhVMzl8qqf6L4zw_-a_4bcNqKqw</recordid><startdate>20130801</startdate><enddate>20130801</enddate><creator>Sharif, Ahmed</creator><creator>Lim, Jun zhang</creator><creator>Made, Riko I</creator><creator>Lau, Fu Long</creator><creator>Phua, Eric Jian Rong</creator><creator>Lim, Ju Dy</creator><creator>Wong, Chee Cheong</creator><creator>Gan, Chee Lip</creator><creator>Chen, Zhong</creator><general>Springer US</general><general>Springer</general><general>Springer Nature B.V</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8AO</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope></search><sort><creationdate>20130801</creationdate><title>Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates</title><author>Sharif, Ahmed ; Lim, Jun zhang ; Made, Riko I ; Lau, Fu Long ; Phua, Eric Jian Rong ; Lim, Ju Dy ; Wong, Chee Cheong ; Gan, Chee Lip ; Chen, Zhong</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c346t-c87ed5ea2215eabc409be258050a7ae12a477f448002a682fc784f34143caa583</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Applied sciences</topic><topic>Ceramics</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Electronics</topic><topic>Electronics and Microelectronics</topic><topic>Exact sciences and technology</topic><topic>Glass</topic><topic>High temperature</topic><topic>Instrumentation</topic><topic>Materials Science</topic><topic>Mechanical and acoustical properties</topic><topic>Metals</topic><topic>Microelectronic fabrication (materials and surfaces technology)</topic><topic>Optical and Electronic Materials</topic><topic>Physical properties of thin films, nonelectronic</topic><topic>Physics</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Solid State Physics</topic><topic>Structure and morphology; thickness</topic><topic>Substrates</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><topic>Thin film structure and morphology</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Sharif, Ahmed</creatorcontrib><creatorcontrib>Lim, Jun zhang</creatorcontrib><creatorcontrib>Made, Riko I</creatorcontrib><creatorcontrib>Lau, Fu Long</creatorcontrib><creatorcontrib>Phua, Eric Jian Rong</creatorcontrib><creatorcontrib>Lim, Ju Dy</creatorcontrib><creatorcontrib>Wong, Chee Cheong</creatorcontrib><creatorcontrib>Gan, Chee Lip</creatorcontrib><creatorcontrib>Chen, Zhong</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library</collection><collection>Science Database</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Sharif, Ahmed</au><au>Lim, Jun zhang</au><au>Made, Riko I</au><au>Lau, Fu Long</au><au>Phua, Eric Jian Rong</au><au>Lim, Ju Dy</au><au>Wong, Chee Cheong</au><au>Gan, Chee Lip</au><au>Chen, Zhong</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates</atitle><jtitle>Journal of electronic materials</jtitle><stitle>Journal of Elec Materi</stitle><date>2013-08-01</date><risdate>2013</risdate><volume>42</volume><issue>8</issue><spage>2667</spage><epage>2676</epage><pages>2667-2676</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><coden>JECMA5</coden><abstract>A lead-free glass frit paste as a die-attach material for high-temperature microelectronic application is proposed in this study. The glass paste containing Bi-based powder with a moderate amount of solvent was used for joining Si dice on ceramic substrates without any metallization preparation for either of the bonding surfaces. The die was bonded to a ceramic substrate at 430°C for 10 min. The study focuses on the mechanical and microstructural characterization of the joints with Si dice on two different types of ceramic substrate. Shear strength measurements were carried out at both ambient and 250°C to evaluate room- and high-temperature performance. Furthermore, the effect of aging at 300°C for 500 h on the mechanical properties is presented. The results of the mechanical and microstructural characterization demonstrate that low-temperature glass frit bonding is an effective die-attach method for harsh-environment electronic packaging.</abstract><cop>Boston</cop><pub>Springer US</pub><doi>10.1007/s11664-013-2613-0</doi><tpages>10</tpages></addata></record> |
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| subjects | Applied sciences Ceramics Characterization and Evaluation of Materials Chemistry and Materials Science Condensed matter: structure, mechanical and thermal properties Electronics Electronics and Microelectronics Exact sciences and technology Glass High temperature Instrumentation Materials Science Mechanical and acoustical properties Metals Microelectronic fabrication (materials and surfaces technology) Optical and Electronic Materials Physical properties of thin films, nonelectronic Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Solid State Physics Structure and morphology thickness Substrates Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thin film structure and morphology |
| title | Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates |
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