An economic CVD technique for pure SnO2 thin films deposition: Temperature effects

A modified new method of CVD for formation of pure layers of tin oxide films was developed. This method is very simple and inexpensive and produces films with good electrical properties. The effect of substrate temperature on the sheet resistance, resistivity, mobility, carrier concentration and tra...

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Veröffentlicht in:Bulletin of materials science 2013-04, Vol.36 (2), p.217-221
Hauptverfasser: MALEKI, M, ROZATI, S M
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description A modified new method of CVD for formation of pure layers of tin oxide films was developed. This method is very simple and inexpensive and produces films with good electrical properties. The effect of substrate temperature on the sheet resistance, resistivity, mobility, carrier concentration and transparency of the films has been studied. The best sheet resistance obtained at substrate temperature of 500 °C was about 27 Ω/cm 2 . X-ray diffraction showed that the structure of deposited films was polycrystalline with a grain size between 150–300 Å. The preferred orientation was (211) for films deposited at substrate temperature of about 500 °C. FESEM micrographs revealed that substrate temperature is an important factor for increasing grain size and modifies electrical parameters. UV-visible measurement showed reduction of transparency and bandgap of the layers with increasing substrate temperature.
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subjects Atmospheric pressure
Carrier density
Casting
Chemical vapor deposition
Chemistry and Materials Science
Electrical properties
Electrical resistivity
Engineering
Glass substrates
Grain size
Materials Science
Oxidation
Oxide coatings
Parameter modification
Photomicrographs
Preferred orientation
Substrates
Temperature effects
Thin films
Tin
Tin dioxide
Tin oxides
title An economic CVD technique for pure SnO2 thin films deposition: Temperature effects
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