Influence of the substrate thermal expansion coefficient on the morphology and elastic stress of CoSb3 thin films
During the post‐annealing and cooling process of CoSb3 thin films deposited on thermally oxidized Si(100) substrates, cracks occur at the surface of the films, which can be caused by the difference in thermal expansion coefficient of the substrate and the film. To investigate the crack formation, 40...
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Veröffentlicht in: | Physica status solidi. A, Applications and materials science Applications and materials science, 2013-01, Vol.210 (1), p.140-146 |
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creator | Daniel, M. Friedemann, M. Jöhrmann, N. Liebig, A. Donges, J. Hietschold, M. Beddies, G. Albrecht, M. |
description | During the post‐annealing and cooling process of CoSb3 thin films deposited on thermally oxidized Si(100) substrates, cracks occur at the surface of the films, which can be caused by the difference in thermal expansion coefficient of the substrate and the film. To investigate the crack formation, 40‐nm‐thick CoSb3 films were deposited at room temperature under ultra‐high vacuum (UHV) conditions onto various substrates, exhibiting different thermal expansion coefficients (2 × 10−6 to 12 × 10−6 K−1). All samples were post‐annealed in UHV at 500 °C for 1 h. The composition of the films was verified by Rutherford backscattering spectrometry. The phase formation and elastic stress of the films were analyzed by X‐ray diffraction, confirming the formation of the desired skutterudite phase, while the individual grains were studied by electron backscatter diffraction. In addition, the surface morphology and the roughness of the films were investigated by atomic force microscopy. For substrates with a thermal expansion coefficient between 9 × 10−6 and 11 × 10−6 K−1, crack formation can be prevented and a minimum in roughness was found, resulting also in a minimal value of the electrical resistivity. |
doi_str_mv | 10.1002/pssa.201228388 |
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To investigate the crack formation, 40‐nm‐thick CoSb3 films were deposited at room temperature under ultra‐high vacuum (UHV) conditions onto various substrates, exhibiting different thermal expansion coefficients (2 × 10−6 to 12 × 10−6 K−1). All samples were post‐annealed in UHV at 500 °C for 1 h. The composition of the films was verified by Rutherford backscattering spectrometry. The phase formation and elastic stress of the films were analyzed by X‐ray diffraction, confirming the formation of the desired skutterudite phase, while the individual grains were studied by electron backscatter diffraction. In addition, the surface morphology and the roughness of the films were investigated by atomic force microscopy. For substrates with a thermal expansion coefficient between 9 × 10−6 and 11 × 10−6 K−1, crack formation can be prevented and a minimum in roughness was found, resulting also in a minimal value of the electrical resistivity.</description><identifier>ISSN: 1862-6300</identifier><identifier>EISSN: 1862-6319</identifier><identifier>DOI: 10.1002/pssa.201228388</identifier><language>eng</language><publisher>Berlin: WILEY-VCH Verlag</publisher><subject>CoSb3 ; crack formation ; skutterudites ; thermal expansion coefficients ; thermal stability ; thermoelectricity</subject><ispartof>Physica status solidi. A, Applications and materials science, 2013-01, Vol.210 (1), p.140-146</ispartof><rights>Copyright © 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim</rights><rights>Copyright © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1002%2Fpssa.201228388$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1002%2Fpssa.201228388$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,780,784,1417,27924,27925,45574,45575</link.rule.ids></links><search><creatorcontrib>Daniel, M.</creatorcontrib><creatorcontrib>Friedemann, M.</creatorcontrib><creatorcontrib>Jöhrmann, N.</creatorcontrib><creatorcontrib>Liebig, A.</creatorcontrib><creatorcontrib>Donges, J.</creatorcontrib><creatorcontrib>Hietschold, M.</creatorcontrib><creatorcontrib>Beddies, G.</creatorcontrib><creatorcontrib>Albrecht, M.</creatorcontrib><title>Influence of the substrate thermal expansion coefficient on the morphology and elastic stress of CoSb3 thin films</title><title>Physica status solidi. A, Applications and materials science</title><addtitle>Phys. Status Solidi A</addtitle><description>During the post‐annealing and cooling process of CoSb3 thin films deposited on thermally oxidized Si(100) substrates, cracks occur at the surface of the films, which can be caused by the difference in thermal expansion coefficient of the substrate and the film. To investigate the crack formation, 40‐nm‐thick CoSb3 films were deposited at room temperature under ultra‐high vacuum (UHV) conditions onto various substrates, exhibiting different thermal expansion coefficients (2 × 10−6 to 12 × 10−6 K−1). All samples were post‐annealed in UHV at 500 °C for 1 h. The composition of the films was verified by Rutherford backscattering spectrometry. The phase formation and elastic stress of the films were analyzed by X‐ray diffraction, confirming the formation of the desired skutterudite phase, while the individual grains were studied by electron backscatter diffraction. In addition, the surface morphology and the roughness of the films were investigated by atomic force microscopy. For substrates with a thermal expansion coefficient between 9 × 10−6 and 11 × 10−6 K−1, crack formation can be prevented and a minimum in roughness was found, resulting also in a minimal value of the electrical resistivity.</description><subject>CoSb3</subject><subject>crack formation</subject><subject>skutterudites</subject><subject>thermal expansion coefficients</subject><subject>thermal stability</subject><subject>thermoelectricity</subject><issn>1862-6300</issn><issn>1862-6319</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNo9kM9LwzAcxYsoOKdXzwHP1fxs0uMYOgdjKtXtGNI2dZlt0jUtbv-9LZOevu_B570vvCC4R_ARQYifau_VI4YIY0GEuAgmSEQ4jAiKL0cN4XVw4_0eQsooR5PgsLRF2WmbaeAK0O408F3q20a1enBNpUqgj7Wy3jgLMqeLwmRG2xb0dsAr19Q7V7rvE1A2B7pUvjUZ6Cu090Pn3CUp6VFjQWHKyt8GV4Uqvb77v9Pg6-X5c_4art4Wy_lsFRrMkQh5QWhMWc6pSJUimELImE4V50ypjKGM5zgiIkOI0FTkOmM5pkQLDGksBCnINHg499aNO3Tat3Lvusb2LyUiGCOOIKI9FZ-pX1Pqk6wbU6nmJBGUw6Zy2FSOm8r3JJmNrs-G56zxrT6OWdX8yIgTzuR2vZDr7cdCsGQjN-QPGnV9cA</recordid><startdate>201301</startdate><enddate>201301</enddate><creator>Daniel, M.</creator><creator>Friedemann, M.</creator><creator>Jöhrmann, N.</creator><creator>Liebig, A.</creator><creator>Donges, J.</creator><creator>Hietschold, M.</creator><creator>Beddies, G.</creator><creator>Albrecht, M.</creator><general>WILEY-VCH Verlag</general><general>WILEY‐VCH Verlag</general><general>Wiley Subscription Services, Inc</general><scope>BSCLL</scope><scope>7SP</scope><scope>7SR</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>201301</creationdate><title>Influence of the substrate thermal expansion coefficient on the morphology and elastic stress of CoSb3 thin films</title><author>Daniel, M. ; Friedemann, M. ; Jöhrmann, N. ; Liebig, A. ; Donges, J. ; Hietschold, M. ; Beddies, G. ; Albrecht, M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i2718-7f34945d748baa3240055eba775aac51c7d2638c1134b8dec5d243e82049883f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>CoSb3</topic><topic>crack formation</topic><topic>skutterudites</topic><topic>thermal expansion coefficients</topic><topic>thermal stability</topic><topic>thermoelectricity</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Daniel, M.</creatorcontrib><creatorcontrib>Friedemann, M.</creatorcontrib><creatorcontrib>Jöhrmann, N.</creatorcontrib><creatorcontrib>Liebig, A.</creatorcontrib><creatorcontrib>Donges, J.</creatorcontrib><creatorcontrib>Hietschold, M.</creatorcontrib><creatorcontrib>Beddies, G.</creatorcontrib><creatorcontrib>Albrecht, M.</creatorcontrib><collection>Istex</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Physica status solidi. A, Applications and materials science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Daniel, M.</au><au>Friedemann, M.</au><au>Jöhrmann, N.</au><au>Liebig, A.</au><au>Donges, J.</au><au>Hietschold, M.</au><au>Beddies, G.</au><au>Albrecht, M.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Influence of the substrate thermal expansion coefficient on the morphology and elastic stress of CoSb3 thin films</atitle><jtitle>Physica status solidi. A, Applications and materials science</jtitle><addtitle>Phys. Status Solidi A</addtitle><date>2013-01</date><risdate>2013</risdate><volume>210</volume><issue>1</issue><spage>140</spage><epage>146</epage><pages>140-146</pages><issn>1862-6300</issn><eissn>1862-6319</eissn><abstract>During the post‐annealing and cooling process of CoSb3 thin films deposited on thermally oxidized Si(100) substrates, cracks occur at the surface of the films, which can be caused by the difference in thermal expansion coefficient of the substrate and the film. To investigate the crack formation, 40‐nm‐thick CoSb3 films were deposited at room temperature under ultra‐high vacuum (UHV) conditions onto various substrates, exhibiting different thermal expansion coefficients (2 × 10−6 to 12 × 10−6 K−1). All samples were post‐annealed in UHV at 500 °C for 1 h. The composition of the films was verified by Rutherford backscattering spectrometry. The phase formation and elastic stress of the films were analyzed by X‐ray diffraction, confirming the formation of the desired skutterudite phase, while the individual grains were studied by electron backscatter diffraction. In addition, the surface morphology and the roughness of the films were investigated by atomic force microscopy. For substrates with a thermal expansion coefficient between 9 × 10−6 and 11 × 10−6 K−1, crack formation can be prevented and a minimum in roughness was found, resulting also in a minimal value of the electrical resistivity.</abstract><cop>Berlin</cop><pub>WILEY-VCH Verlag</pub><doi>10.1002/pssa.201228388</doi><tpages>7</tpages></addata></record> |
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subjects | CoSb3 crack formation skutterudites thermal expansion coefficients thermal stability thermoelectricity |
title | Influence of the substrate thermal expansion coefficient on the morphology and elastic stress of CoSb3 thin films |
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