Effect of Annealing Twins on Electromigration in Ag-8Au-3Pd Bonding Wires

An innovative Ag-8Au-3Pd bonding wire with a high twin density has been produced. The grain size of this annealing-twinned wire changes moderately during electrical stressing, unlike that of the conventional grained wire, which increases drastically and even leads to a bamboo structure. In addition,...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Journal of electronic materials 2013-03, Vol.42 (3), p.545-551
Hauptverfasser:	Chuang, Tung-Han, Wang, Hsi-Ching, Chuang, Chien-Hsun, Lee, Jun-Der, Tsai, Hsing-Hua
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Annealing Applied sciences Brazing. Soldering Characterization and Evaluation of Materials Chemistry and Materials Science Condensed matter: structure, mechanical and thermal properties Diffusion in solids Electromigration Electronics Electronics and Microelectronics Exact sciences and technology Instrumentation Interfacial bonding Joining, thermal cutting: metallurgical aspects Materials Materials Science Mechanical properties Metals. Metallurgy Optical and Electronic Materials Physics Solid State Physics Transport properties of condensed matter (nonelectronic) Wire
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!