Recent Advances in Bi-2212 Round Wire Performance for High Field Applications
There has been sustained interest in the development of Bi-2212/Ag round wire because of its unique potential for application in ultra-high-field magnets (>; 25 T). Our development activity with this material has been focused on improving the engineering current density. Filament densification by...
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Veröffentlicht in: | IEEE transactions on applied superconductivity 2013-06, Vol.23 (3), p.6400104-6400104 |
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container_title | IEEE transactions on applied superconductivity |
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creator | Hanping Miao Yibing Huang Seung Hong Parrell, J. A. |
description | There has been sustained interest in the development of Bi-2212/Ag round wire because of its unique potential for application in ultra-high-field magnets (>; 25 T). Our development activity with this material has been focused on improving the engineering current density. Filament densification by swaging and isostatic pressing processes have been evaluated, as has further optimization of the melt heat treatment conditions. These improvements lead to an increased mass density of the filament in the final wire, and are essential to reduce filament porosity and obtain high performance over long wire length. Engineering current density values exceeding 480 A/mm 2 at 4.2 K, 15 T have been achieved on 1-m-long barrel samples. |
doi_str_mv | 10.1109/TASC.2012.2232704 |
format | Article |
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A.</creator><creatorcontrib>Hanping Miao ; Yibing Huang ; Seung Hong ; Parrell, J. A.</creatorcontrib><description>There has been sustained interest in the development of Bi-2212/Ag round wire because of its unique potential for application in ultra-high-field magnets (>; 25 T). Our development activity with this material has been focused on improving the engineering current density. Filament densification by swaging and isostatic pressing processes have been evaluated, as has further optimization of the melt heat treatment conditions. These improvements lead to an increased mass density of the filament in the final wire, and are essential to reduce filament porosity and obtain high performance over long wire length. Engineering current density values exceeding 480 A/mm 2 at 4.2 K, 15 T have been achieved on 1-m-long barrel samples.</description><identifier>ISSN: 1051-8223</identifier><identifier>EISSN: 1558-2515</identifier><identifier>DOI: 10.1109/TASC.2012.2232704</identifier><identifier>CODEN: ITASE9</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>APPLICATIONS ; Applied sciences ; Bi-2212 round wire ; BISMUTH OXIDE ; COPPER OXIDE ; CURRENT DENSITY ; Densification ; DENSITY ; Electrical engineering. Electrical power engineering ; Electromagnets ; Electronics ; Exact sciences and technology ; Filaments ; Heat treatment ; Heating ; High temperature superconductors ; Isostatic pressing ; Magnetic fields ; Materials ; Melts ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Superconducting devices ; Superconducting magnets ; superconducting wire processing ; SUPERCONDUCTIVITY ; SUPERCONDUCTORS ; Swaging ; Various equipment and components ; WIRE ; Wires</subject><ispartof>IEEE transactions on applied superconductivity, 2013-06, Vol.23 (3), p.6400104-6400104</ispartof><rights>2014 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Jun 2013</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c356t-5da33533a2a87d9c53e5d7ae3b9b2f3040a946512499d17fa3e0f7e8958f670b3</citedby><cites>FETCH-LOGICAL-c356t-5da33533a2a87d9c53e5d7ae3b9b2f3040a946512499d17fa3e0f7e8958f670b3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6380547$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>310,311,315,781,785,790,791,797,23932,23933,25142,27926,27927,54760</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6380547$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=27529694$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Hanping Miao</creatorcontrib><creatorcontrib>Yibing Huang</creatorcontrib><creatorcontrib>Seung Hong</creatorcontrib><creatorcontrib>Parrell, J. A.</creatorcontrib><title>Recent Advances in Bi-2212 Round Wire Performance for High Field Applications</title><title>IEEE transactions on applied superconductivity</title><addtitle>TASC</addtitle><description>There has been sustained interest in the development of Bi-2212/Ag round wire because of its unique potential for application in ultra-high-field magnets (>; 25 T). Our development activity with this material has been focused on improving the engineering current density. Filament densification by swaging and isostatic pressing processes have been evaluated, as has further optimization of the melt heat treatment conditions. These improvements lead to an increased mass density of the filament in the final wire, and are essential to reduce filament porosity and obtain high performance over long wire length. Engineering current density values exceeding 480 A/mm 2 at 4.2 K, 15 T have been achieved on 1-m-long barrel samples.</description><subject>APPLICATIONS</subject><subject>Applied sciences</subject><subject>Bi-2212 round wire</subject><subject>BISMUTH OXIDE</subject><subject>COPPER OXIDE</subject><subject>CURRENT DENSITY</subject><subject>Densification</subject><subject>DENSITY</subject><subject>Electrical engineering. Electrical power engineering</subject><subject>Electromagnets</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Filaments</subject><subject>Heat treatment</subject><subject>Heating</subject><subject>High temperature superconductors</subject><subject>Isostatic pressing</subject><subject>Magnetic fields</subject><subject>Materials</subject><subject>Melts</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Superconducting devices</subject><subject>Superconducting magnets</subject><subject>superconducting wire processing</subject><subject>SUPERCONDUCTIVITY</subject><subject>SUPERCONDUCTORS</subject><subject>Swaging</subject><subject>Various equipment and components</subject><subject>WIRE</subject><subject>Wires</subject><issn>1051-8223</issn><issn>1558-2515</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpdkMFKw0AQhoMoWKsPIF4WRPCSujObzWaPtVgrVJRa8bhsk4luSZO62wq-vQktPXiagf-bn-GLokvgAwCu7-bDt9EAOeAAUaDiyVHUAymzGCXI43bnEuKszU6jsxCWnEOSJbIXPc8op3rDhsWPrXMKzNXs3sWIgGzWbOuCfThP7JV82fhVh7B2YRP3-cXGjqqCDdfryuV245o6nEcnpa0CXexnP3ofP8xHk3j68vg0Gk7jXMh0E8vCCiGFsGgzVehcCpKFsiQWeoGl4Am3OkklYKJ1Aaq0gnipKNMyK1PFF6If3e5617753lLYmJULOVWVranZBgOilQAIoFv0-h-6bLa-br8zgArTVGrsKNhRuW9C8FSatXcr638NcNMJNp1g0wk2e8Htzc2-2YbcVqVv7bhwOEQlUae64652nCOiQ5yKjMtEiT9EEYBi</recordid><startdate>20130601</startdate><enddate>20130601</enddate><creator>Hanping Miao</creator><creator>Yibing Huang</creator><creator>Seung Hong</creator><creator>Parrell, J. A.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope><scope>F28</scope><scope>FR3</scope><scope>H8G</scope><scope>JG9</scope></search><sort><creationdate>20130601</creationdate><title>Recent Advances in Bi-2212 Round Wire Performance for High Field Applications</title><author>Hanping Miao ; Yibing Huang ; Seung Hong ; Parrell, J. A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c356t-5da33533a2a87d9c53e5d7ae3b9b2f3040a946512499d17fa3e0f7e8958f670b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>APPLICATIONS</topic><topic>Applied sciences</topic><topic>Bi-2212 round wire</topic><topic>BISMUTH OXIDE</topic><topic>COPPER OXIDE</topic><topic>CURRENT DENSITY</topic><topic>Densification</topic><topic>DENSITY</topic><topic>Electrical engineering. Electrical power engineering</topic><topic>Electromagnets</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Filaments</topic><topic>Heat treatment</topic><topic>Heating</topic><topic>High temperature superconductors</topic><topic>Isostatic pressing</topic><topic>Magnetic fields</topic><topic>Materials</topic><topic>Melts</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Superconducting devices</topic><topic>Superconducting magnets</topic><topic>superconducting wire processing</topic><topic>SUPERCONDUCTIVITY</topic><topic>SUPERCONDUCTORS</topic><topic>Swaging</topic><topic>Various equipment and components</topic><topic>WIRE</topic><topic>Wires</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Hanping Miao</creatorcontrib><creatorcontrib>Yibing Huang</creatorcontrib><creatorcontrib>Seung Hong</creatorcontrib><creatorcontrib>Parrell, J. 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A.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Recent Advances in Bi-2212 Round Wire Performance for High Field Applications</atitle><jtitle>IEEE transactions on applied superconductivity</jtitle><stitle>TASC</stitle><date>2013-06-01</date><risdate>2013</risdate><volume>23</volume><issue>3</issue><spage>6400104</spage><epage>6400104</epage><pages>6400104-6400104</pages><issn>1051-8223</issn><eissn>1558-2515</eissn><coden>ITASE9</coden><abstract>There has been sustained interest in the development of Bi-2212/Ag round wire because of its unique potential for application in ultra-high-field magnets (>; 25 T). Our development activity with this material has been focused on improving the engineering current density. Filament densification by swaging and isostatic pressing processes have been evaluated, as has further optimization of the melt heat treatment conditions. These improvements lead to an increased mass density of the filament in the final wire, and are essential to reduce filament porosity and obtain high performance over long wire length. Engineering current density values exceeding 480 A/mm 2 at 4.2 K, 15 T have been achieved on 1-m-long barrel samples.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/TASC.2012.2232704</doi><tpages>1</tpages></addata></record> |
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subjects | APPLICATIONS Applied sciences Bi-2212 round wire BISMUTH OXIDE COPPER OXIDE CURRENT DENSITY Densification DENSITY Electrical engineering. Electrical power engineering Electromagnets Electronics Exact sciences and technology Filaments Heat treatment Heating High temperature superconductors Isostatic pressing Magnetic fields Materials Melts Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Superconducting devices Superconducting magnets superconducting wire processing SUPERCONDUCTIVITY SUPERCONDUCTORS Swaging Various equipment and components WIRE Wires |
title | Recent Advances in Bi-2212 Round Wire Performance for High Field Applications |
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