Solder Joint Inspection Method for Chip Component Using Improved AdaBoost and Decision Tree

To improve the performance of automatic optical inspection (AOI), a new inspection method for chip component of mounted components on printed circuit boards is developed. In this paper, the inspection procedure is divided into training stage and test stage. In the training stage, first, the solder j...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2011-12, Vol.1 (12), p.2018-2027
Hauptverfasser:	Hongwei, Xie, Xianmin, Zhang, Yongcong, Kuang, Gaofei, Ouyang
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Automatic optical inspection Classification Color decision tree Decision trees Design. Technologies. Operation analysis. Testing Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Feature extraction feature selection Image color analysis Inspection Integrated circuits printed circuit board Printed circuit boards Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices solder joint Soldering Studies Testing, measurement, noise and reliability Training
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