Thermal characteristics of TAB for small systems

The thermal effects of natural or forced convection cooling, component placement, and circuit and card orientation are discussed for tape automated bonding (TAB) components in a steady-state operating condition. Included is the effect of locating the low-profile TAB module in the downstream wake of...

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Veröffentlicht in:	IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1990-12, Vol.13 (4), p.989-997
Hauptverfasser:	McNelis, B., Buller, L.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Assembly Bonding Circuits Consumer electronics Design. Technologies. Operation analysis. Testing Electronic packaging thermal management Electronics Electronics cooling Electronics packaging Exact sciences and technology Integrated circuits Microcomputers Polyimides Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Workstations
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