Lens-coupled laser diode module integrated on silicon platform
Recent interests in the development of multiservice systems have increased the activities be reduced. However, current commercial-grade manufacturing cannot satisfy these needs. The conventional assembly method results in the labor-intensive in optical access networks, such as fiber to the home (FTT...
Gespeichert in:
| Veröffentlicht in: | Journal of lightwave technology 1996-06, Vol.14 (6), p.1519-1523 |
|---|---|
| Hauptverfasser: | , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 1523 |
|---|---|
| container_issue | 6 |
| container_start_page | 1519 |
| container_title | Journal of lightwave technology |
| container_volume | 14 |
| creator | Nakagawa, G. Miura, K. Sasaki, S. Yano, M. |
| description | Recent interests in the development of multiservice systems have increased the activities be reduced. However, current commercial-grade manufacturing cannot satisfy these needs. The conventional assembly method results in the labor-intensive in optical access networks, such as fiber to the home (FTTH). For these systems to be viable, the optical module assemble costs and package size must process of finding the optimum optical coupling position. In addition, the number and size of parts cannot be reduced due to the difficulty of manipulating them. As a new approach for a lower cost, compact packaging solution, silicon platform technology is very promising. This paper describe a lens-coupled laser diode module integrated on a silicon platform, where a laser-diode, a GRIN rod lens, and single-mode fiber are hybridly integrated on a silicon platform by passive alignment. |
| doi_str_mv | 10.1109/50.511682 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_pascalfrancis_primary_3125487</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>511682</ieee_id><sourcerecordid>28335026</sourcerecordid><originalsourceid>FETCH-LOGICAL-c306t-2081b2653d5b2383edbc7062de65e5c182dddb93e3fdcda349b36286178774303</originalsourceid><addsrcrecordid>eNo9kL9LxDAYhoMoeJ4Ork4dRHDomeRr0twiiPgLDlx0DmnyVSJpU5N28L-30uOmd3if9xleQi4Z3TBGt3eCbgRjUvEjsmJCqJJzBsdkRWuAUtW8OiVnOX9TyqpK1Styv8M-lzZOQ0BXBJMxFc5Hh0UX3RSw8P2IX8mMcxv7Ivvg7ZxDMGMbU3dOTloTMl7sc00-n58-Hl_L3fvL2-PDrrRA5VhyqljDpQAnGg4K0DW2ppI7lAKFZYo755otILTOOgPVtgHJlWS1qusKKKzJzeIdUvyZMI-689liCKbHOGXNFYCgXM7g7QLaFHNO2Ooh-c6kX82o_n9IC6qXh2b2ei812ZrQJtNbnw8DYFzMH83Y1YJ5RDy0e8cfjVVsVQ</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>28335026</pqid></control><display><type>article</type><title>Lens-coupled laser diode module integrated on silicon platform</title><source>IEEE Electronic Library (IEL)</source><creator>Nakagawa, G. ; Miura, K. ; Sasaki, S. ; Yano, M.</creator><creatorcontrib>Nakagawa, G. ; Miura, K. ; Sasaki, S. ; Yano, M.</creatorcontrib><description>Recent interests in the development of multiservice systems have increased the activities be reduced. However, current commercial-grade manufacturing cannot satisfy these needs. The conventional assembly method results in the labor-intensive in optical access networks, such as fiber to the home (FTTH). For these systems to be viable, the optical module assemble costs and package size must process of finding the optimum optical coupling position. In addition, the number and size of parts cannot be reduced due to the difficulty of manipulating them. As a new approach for a lower cost, compact packaging solution, silicon platform technology is very promising. This paper describe a lens-coupled laser diode module integrated on a silicon platform, where a laser-diode, a GRIN rod lens, and single-mode fiber are hybridly integrated on a silicon platform by passive alignment.</description><identifier>ISSN: 0733-8724</identifier><identifier>EISSN: 1558-2213</identifier><identifier>DOI: 10.1109/50.511682</identifier><identifier>CODEN: JLTEDG</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Applied sciences ; Assembly systems ; Circuit properties ; Cost function ; Diode lasers ; Electric, optical and optoelectronic circuits ; Electronics ; Exact sciences and technology ; Fiber lasers ; Integrated optoelectronics. Optoelectronic circuits ; Manufacturing ; Optical and optoelectronic circuits ; Optical coupling ; Optical fiber networks ; Optical fiber subscriber loops ; Packaging ; Silicon</subject><ispartof>Journal of lightwave technology, 1996-06, Vol.14 (6), p.1519-1523</ispartof><rights>1996 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c306t-2081b2653d5b2383edbc7062de65e5c182dddb93e3fdcda349b36286178774303</citedby><cites>FETCH-LOGICAL-c306t-2081b2653d5b2383edbc7062de65e5c182dddb93e3fdcda349b36286178774303</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/511682$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/511682$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=3125487$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Nakagawa, G.</creatorcontrib><creatorcontrib>Miura, K.</creatorcontrib><creatorcontrib>Sasaki, S.</creatorcontrib><creatorcontrib>Yano, M.</creatorcontrib><title>Lens-coupled laser diode module integrated on silicon platform</title><title>Journal of lightwave technology</title><addtitle>JLT</addtitle><description>Recent interests in the development of multiservice systems have increased the activities be reduced. However, current commercial-grade manufacturing cannot satisfy these needs. The conventional assembly method results in the labor-intensive in optical access networks, such as fiber to the home (FTTH). For these systems to be viable, the optical module assemble costs and package size must process of finding the optimum optical coupling position. In addition, the number and size of parts cannot be reduced due to the difficulty of manipulating them. As a new approach for a lower cost, compact packaging solution, silicon platform technology is very promising. This paper describe a lens-coupled laser diode module integrated on a silicon platform, where a laser-diode, a GRIN rod lens, and single-mode fiber are hybridly integrated on a silicon platform by passive alignment.</description><subject>Applied sciences</subject><subject>Assembly systems</subject><subject>Circuit properties</subject><subject>Cost function</subject><subject>Diode lasers</subject><subject>Electric, optical and optoelectronic circuits</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Fiber lasers</subject><subject>Integrated optoelectronics. Optoelectronic circuits</subject><subject>Manufacturing</subject><subject>Optical and optoelectronic circuits</subject><subject>Optical coupling</subject><subject>Optical fiber networks</subject><subject>Optical fiber subscriber loops</subject><subject>Packaging</subject><subject>Silicon</subject><issn>0733-8724</issn><issn>1558-2213</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1996</creationdate><recordtype>article</recordtype><recordid>eNo9kL9LxDAYhoMoeJ4Ork4dRHDomeRr0twiiPgLDlx0DmnyVSJpU5N28L-30uOmd3if9xleQi4Z3TBGt3eCbgRjUvEjsmJCqJJzBsdkRWuAUtW8OiVnOX9TyqpK1Styv8M-lzZOQ0BXBJMxFc5Hh0UX3RSw8P2IX8mMcxv7Ivvg7ZxDMGMbU3dOTloTMl7sc00-n58-Hl_L3fvL2-PDrrRA5VhyqljDpQAnGg4K0DW2ppI7lAKFZYo755otILTOOgPVtgHJlWS1qusKKKzJzeIdUvyZMI-689liCKbHOGXNFYCgXM7g7QLaFHNO2Ooh-c6kX82o_n9IC6qXh2b2ei812ZrQJtNbnw8DYFzMH83Y1YJ5RDy0e8cfjVVsVQ</recordid><startdate>19960601</startdate><enddate>19960601</enddate><creator>Nakagawa, G.</creator><creator>Miura, K.</creator><creator>Sasaki, S.</creator><creator>Yano, M.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>19960601</creationdate><title>Lens-coupled laser diode module integrated on silicon platform</title><author>Nakagawa, G. ; Miura, K. ; Sasaki, S. ; Yano, M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c306t-2081b2653d5b2383edbc7062de65e5c182dddb93e3fdcda349b36286178774303</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1996</creationdate><topic>Applied sciences</topic><topic>Assembly systems</topic><topic>Circuit properties</topic><topic>Cost function</topic><topic>Diode lasers</topic><topic>Electric, optical and optoelectronic circuits</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Fiber lasers</topic><topic>Integrated optoelectronics. Optoelectronic circuits</topic><topic>Manufacturing</topic><topic>Optical and optoelectronic circuits</topic><topic>Optical coupling</topic><topic>Optical fiber networks</topic><topic>Optical fiber subscriber loops</topic><topic>Packaging</topic><topic>Silicon</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Nakagawa, G.</creatorcontrib><creatorcontrib>Miura, K.</creatorcontrib><creatorcontrib>Sasaki, S.</creatorcontrib><creatorcontrib>Yano, M.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of lightwave technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Nakagawa, G.</au><au>Miura, K.</au><au>Sasaki, S.</au><au>Yano, M.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Lens-coupled laser diode module integrated on silicon platform</atitle><jtitle>Journal of lightwave technology</jtitle><stitle>JLT</stitle><date>1996-06-01</date><risdate>1996</risdate><volume>14</volume><issue>6</issue><spage>1519</spage><epage>1523</epage><pages>1519-1523</pages><issn>0733-8724</issn><eissn>1558-2213</eissn><coden>JLTEDG</coden><abstract>Recent interests in the development of multiservice systems have increased the activities be reduced. However, current commercial-grade manufacturing cannot satisfy these needs. The conventional assembly method results in the labor-intensive in optical access networks, such as fiber to the home (FTTH). For these systems to be viable, the optical module assemble costs and package size must process of finding the optimum optical coupling position. In addition, the number and size of parts cannot be reduced due to the difficulty of manipulating them. As a new approach for a lower cost, compact packaging solution, silicon platform technology is very promising. This paper describe a lens-coupled laser diode module integrated on a silicon platform, where a laser-diode, a GRIN rod lens, and single-mode fiber are hybridly integrated on a silicon platform by passive alignment.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/50.511682</doi><tpages>5</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 0733-8724 |
| ispartof | Journal of lightwave technology, 1996-06, Vol.14 (6), p.1519-1523 |
| issn | 0733-8724 1558-2213 |
| language | eng |
| recordid | cdi_pascalfrancis_primary_3125487 |
| source | IEEE Electronic Library (IEL) |
| subjects | Applied sciences Assembly systems Circuit properties Cost function Diode lasers Electric, optical and optoelectronic circuits Electronics Exact sciences and technology Fiber lasers Integrated optoelectronics. Optoelectronic circuits Manufacturing Optical and optoelectronic circuits Optical coupling Optical fiber networks Optical fiber subscriber loops Packaging Silicon |
| title | Lens-coupled laser diode module integrated on silicon platform |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-14T20%3A22%3A27IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Lens-coupled%20laser%20diode%20module%20integrated%20on%20silicon%20platform&rft.jtitle=Journal%20of%20lightwave%20technology&rft.au=Nakagawa,%20G.&rft.date=1996-06-01&rft.volume=14&rft.issue=6&rft.spage=1519&rft.epage=1523&rft.pages=1519-1523&rft.issn=0733-8724&rft.eissn=1558-2213&rft.coden=JLTEDG&rft_id=info:doi/10.1109/50.511682&rft_dat=%3Cproquest_RIE%3E28335026%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=28335026&rft_id=info:pmid/&rft_ieee_id=511682&rfr_iscdi=true |