Industry Compatible Embossing Process for the Fabrication of Waveguide-Embedded Optical Printed Circuit Boards : OPTICAL INTERCONNECTS

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Veröffentlicht in:	Journal of lightwave technology 2013, Vol.31 (21-24), p.4045-4050
Hauptverfasser:	WEI JIN, KIN SENG CHIANG, KAR PONG LOR, HAU PING CHAN, TO, Jack T. L, LEUNG, Raymond H. M
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Circuit properties Electric, optical and optoelectronic circuits Electronics Exact sciences and technology Integrated optics. Optical fibers and wave guides Microelectronic fabrication (materials and surfaces technology) Miscellaneous Optical and optoelectronic circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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ispartof	Journal of lightwave technology, 2013, Vol.31 (21-24), p.4045-4050
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source	IEEE Electronic Library (IEL)
subjects	Applied sciences Circuit properties Electric, optical and optoelectronic circuits Electronics Exact sciences and technology Integrated optics. Optical fibers and wave guides Microelectronic fabrication (materials and surfaces technology) Miscellaneous Optical and optoelectronic circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
title	Industry Compatible Embossing Process for the Fabrication of Waveguide-Embedded Optical Printed Circuit Boards : OPTICAL INTERCONNECTS
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