An integrated electroless nickel plating process for fabrication of CMOS-MEMS probe chip
Gespeichert in:
| Veröffentlicht in: | Microelectronic engineering 2013, Vol.113, p.147-151 |
|---|---|
| Hauptverfasser: | , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 151 |
|---|---|
| container_issue | |
| container_start_page | 147 |
| container_title | Microelectronic engineering |
| container_volume | 113 |
| creator | LEE, Kuo-Yu HUANG, Jung-Tang CHAO, Pen-Shan LIN, Jian-Ming HSU, Hou-Jun |
| description | |
| format | Article |
| fullrecord | <record><control><sourceid>pascalfrancis</sourceid><recordid>TN_cdi_pascalfrancis_primary_27918596</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>27918596</sourcerecordid><originalsourceid>FETCH-pascalfrancis_primary_279185963</originalsourceid><addsrcrecordid>eNqNir0OgjAYABujifjzDt_i2AREKIyGYFyIAw5upNQWq7Vt2i6-vZD4AE6Xu9wMRUlBUpxleTFHUZzkBJdpQpZo5f0zHv0QFxG6HTVIHfjgaOB34Iqz4Izi3oOW7MUVWEWD1ANYZ9iUhXEgaO8kG7vRYARUzaXFTd2009RzYA9pN2ghqPJ8--Ma7U71tTpjSz2jSjiqmfSddfJN3afbkzIpsjJP__2-tPFE0w</addsrcrecordid><sourcetype>Index Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>An integrated electroless nickel plating process for fabrication of CMOS-MEMS probe chip</title><source>Elsevier ScienceDirect Journals</source><creator>LEE, Kuo-Yu ; HUANG, Jung-Tang ; CHAO, Pen-Shan ; LIN, Jian-Ming ; HSU, Hou-Jun</creator><creatorcontrib>LEE, Kuo-Yu ; HUANG, Jung-Tang ; CHAO, Pen-Shan ; LIN, Jian-Ming ; HSU, Hou-Jun</creatorcontrib><identifier>ISSN: 0167-9317</identifier><identifier>EISSN: 1873-5568</identifier><identifier>CODEN: MIENEF</identifier><language>eng</language><publisher>Amsterdam: Elsevier</publisher><subject>Applied sciences ; Cross-disciplinary physics: materials science; rheology ; Design. Technologies. Operation analysis. Testing ; Electrodeposition, electroplating ; Electronics ; Exact sciences and technology ; Instruments, apparatus, components and techniques common to several branches of physics and astronomy ; Integrated circuits ; Materials science ; Mechanical instruments, equipment and techniques ; Methods of deposition of films and coatings; film growth and epitaxy ; Micro- and nanoelectromechanical devices (mems/nems) ; Micromechanical devices and systems ; Physics ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><ispartof>Microelectronic engineering, 2013, Vol.113, p.147-151</ispartof><rights>2014 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,4010</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=27918596$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>LEE, Kuo-Yu</creatorcontrib><creatorcontrib>HUANG, Jung-Tang</creatorcontrib><creatorcontrib>CHAO, Pen-Shan</creatorcontrib><creatorcontrib>LIN, Jian-Ming</creatorcontrib><creatorcontrib>HSU, Hou-Jun</creatorcontrib><title>An integrated electroless nickel plating process for fabrication of CMOS-MEMS probe chip</title><title>Microelectronic engineering</title><subject>Applied sciences</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electrodeposition, electroplating</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Instruments, apparatus, components and techniques common to several branches of physics and astronomy</subject><subject>Integrated circuits</subject><subject>Materials science</subject><subject>Mechanical instruments, equipment and techniques</subject><subject>Methods of deposition of films and coatings; film growth and epitaxy</subject><subject>Micro- and nanoelectromechanical devices (mems/nems)</subject><subject>Micromechanical devices and systems</subject><subject>Physics</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><issn>0167-9317</issn><issn>1873-5568</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNqNir0OgjAYABujifjzDt_i2AREKIyGYFyIAw5upNQWq7Vt2i6-vZD4AE6Xu9wMRUlBUpxleTFHUZzkBJdpQpZo5f0zHv0QFxG6HTVIHfjgaOB34Iqz4Izi3oOW7MUVWEWD1ANYZ9iUhXEgaO8kG7vRYARUzaXFTd2009RzYA9pN2ghqPJ8--Ma7U71tTpjSz2jSjiqmfSddfJN3afbkzIpsjJP__2-tPFE0w</recordid><startdate>2013</startdate><enddate>2013</enddate><creator>LEE, Kuo-Yu</creator><creator>HUANG, Jung-Tang</creator><creator>CHAO, Pen-Shan</creator><creator>LIN, Jian-Ming</creator><creator>HSU, Hou-Jun</creator><general>Elsevier</general><scope>IQODW</scope></search><sort><creationdate>2013</creationdate><title>An integrated electroless nickel plating process for fabrication of CMOS-MEMS probe chip</title><author>LEE, Kuo-Yu ; HUANG, Jung-Tang ; CHAO, Pen-Shan ; LIN, Jian-Ming ; HSU, Hou-Jun</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-pascalfrancis_primary_279185963</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Applied sciences</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Electrodeposition, electroplating</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Instruments, apparatus, components and techniques common to several branches of physics and astronomy</topic><topic>Integrated circuits</topic><topic>Materials science</topic><topic>Mechanical instruments, equipment and techniques</topic><topic>Methods of deposition of films and coatings; film growth and epitaxy</topic><topic>Micro- and nanoelectromechanical devices (mems/nems)</topic><topic>Micromechanical devices and systems</topic><topic>Physics</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>LEE, Kuo-Yu</creatorcontrib><creatorcontrib>HUANG, Jung-Tang</creatorcontrib><creatorcontrib>CHAO, Pen-Shan</creatorcontrib><creatorcontrib>LIN, Jian-Ming</creatorcontrib><creatorcontrib>HSU, Hou-Jun</creatorcontrib><collection>Pascal-Francis</collection><jtitle>Microelectronic engineering</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>LEE, Kuo-Yu</au><au>HUANG, Jung-Tang</au><au>CHAO, Pen-Shan</au><au>LIN, Jian-Ming</au><au>HSU, Hou-Jun</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>An integrated electroless nickel plating process for fabrication of CMOS-MEMS probe chip</atitle><jtitle>Microelectronic engineering</jtitle><date>2013</date><risdate>2013</risdate><volume>113</volume><spage>147</spage><epage>151</epage><pages>147-151</pages><issn>0167-9317</issn><eissn>1873-5568</eissn><coden>MIENEF</coden><cop>Amsterdam</cop><pub>Elsevier</pub></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0167-9317 |
| ispartof | Microelectronic engineering, 2013, Vol.113, p.147-151 |
| issn | 0167-9317 1873-5568 |
| language | eng |
| recordid | cdi_pascalfrancis_primary_27918596 |
| source | Elsevier ScienceDirect Journals |
| subjects | Applied sciences Cross-disciplinary physics: materials science rheology Design. Technologies. Operation analysis. Testing Electrodeposition, electroplating Electronics Exact sciences and technology Instruments, apparatus, components and techniques common to several branches of physics and astronomy Integrated circuits Materials science Mechanical instruments, equipment and techniques Methods of deposition of films and coatings film growth and epitaxy Micro- and nanoelectromechanical devices (mems/nems) Micromechanical devices and systems Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices |
| title | An integrated electroless nickel plating process for fabrication of CMOS-MEMS probe chip |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T12%3A05%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-pascalfrancis&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=An%20integrated%20electroless%20nickel%20plating%20process%20for%20fabrication%20of%20CMOS-MEMS%20probe%20chip&rft.jtitle=Microelectronic%20engineering&rft.au=LEE,%20Kuo-Yu&rft.date=2013&rft.volume=113&rft.spage=147&rft.epage=151&rft.pages=147-151&rft.issn=0167-9317&rft.eissn=1873-5568&rft.coden=MIENEF&rft_id=info:doi/&rft_dat=%3Cpascalfrancis%3E27918596%3C/pascalfrancis%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |