Enhanced deposition rate of sputtered amorphous silicon with a helium and argon gas mixture

Sputtered amorphous silicon thin films have been grown in an atmosphere of helium-argon gas and the effect of helium dilution investigated. The major observed feature is that helium dilution enhances the deposition rate. The highest deposition rate, six times larger than that obtained under conventi...

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Veröffentlicht in:Philosophical magazine letters 1997-08, Vol.76 (2), p.117-123
Hauptverfasser: Aida, M.S., Attaf, N., Benzegouta, A., Hadjeris, L., Selmi, M., Abdelwahab, O.
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container_end_page 123
container_issue 2
container_start_page 117
container_title Philosophical magazine letters
container_volume 76
creator Aida, M.S.
Attaf, N.
Benzegouta, A.
Hadjeris, L.
Selmi, M.
Abdelwahab, O.
description Sputtered amorphous silicon thin films have been grown in an atmosphere of helium-argon gas and the effect of helium dilution investigated. The major observed feature is that helium dilution enhances the deposition rate. The highest deposition rate, six times larger than that obtained under conventional conditions, is reached with equal proportions of helium and argon in the deposition chamber. The influence of helium dilution is explained on the basis of an increase in the argon ionization rate with helium dilution.
doi_str_mv 10.1080/095008397179309
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source Periodicals Index Online; Taylor & Francis Journals Complete
subjects Cross-disciplinary physics: materials science
rheology
Deposition by sputtering
Exact sciences and technology
Materials science
Methods of deposition of films and coatings
film growth and epitaxy
Physics
title Enhanced deposition rate of sputtered amorphous silicon with a helium and argon gas mixture
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