64-kb Hybrid Josephson-CMOS 4 Kelvin RAM With 400 ps Access Time and 12 mW Read Power
We have designed, simulated, fabricated, and tested a 64-kb hybrid Josephson-CMOS memory using a 5 mm × 5 mm Josephson interface chip and a 2.0 × 1.5 mm CMOS chip. The Josephson chip uses the Hypres 4.5 kA/cm 2 niobium technology and the CMOS chip is made using the TSMC 65-nm technology. The chips a...
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Veröffentlicht in: | IEEE transactions on applied superconductivity 2013-06, Vol.23 (3), p.1700504-1700504 |
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creator | Van Duzer, T. Lizhen Zheng Whiteley, S. R. Kim, Hoki Jaewoo Kim Xiaofan Meng Ortlepp, T. |
description | We have designed, simulated, fabricated, and tested a 64-kb hybrid Josephson-CMOS memory using a 5 mm × 5 mm Josephson interface chip and a 2.0 × 1.5 mm CMOS chip. The Josephson chip uses the Hypres 4.5 kA/cm 2 niobium technology and the CMOS chip is made using the TSMC 65-nm technology. The chips are connected using short wire bonds in a piggy-back package. The chip sizes and pad layouts have been constrained to allow testing in our wideband American Cryoprobe Model BCP-2 test probe to measure ultrashort delays. The test signals of 5-mV amplitude are chosen to represent the signals that would be supplied to the memory in a digital computing or signal processing system. Each input signal is first amplified in a four-junction logic gate driving a Suzuki stack, which, in turn, drives a highly sensitive CMOS comparator that raises the signal to volt level. Such amplifiers are provided for the address, data, read, and write inputs to the CMOS memory. Output currents from the memory cells are detected by ultrafast four-junction logic gates providing 5-mV output signals; an equivalent arrangement was used for the delay tests. The overall read delay is the access time, which we find to be about 400 ps. We extrapolate from the measured and calculated power dissipation in this partially accessed 64-kb memory to a fully accessed 64-kb memory and find the expected overall read power dissipation to be about 12 mW for operation at 1 GHz. |
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R. ; Kim, Hoki ; Jaewoo Kim ; Xiaofan Meng ; Ortlepp, T.</creator><creatorcontrib>Van Duzer, T. ; Lizhen Zheng ; Whiteley, S. R. ; Kim, Hoki ; Jaewoo Kim ; Xiaofan Meng ; Ortlepp, T.</creatorcontrib><description>We have designed, simulated, fabricated, and tested a 64-kb hybrid Josephson-CMOS memory using a 5 mm × 5 mm Josephson interface chip and a 2.0 × 1.5 mm CMOS chip. The Josephson chip uses the Hypres 4.5 kA/cm 2 niobium technology and the CMOS chip is made using the TSMC 65-nm technology. The chips are connected using short wire bonds in a piggy-back package. The chip sizes and pad layouts have been constrained to allow testing in our wideband American Cryoprobe Model BCP-2 test probe to measure ultrashort delays. The test signals of 5-mV amplitude are chosen to represent the signals that would be supplied to the memory in a digital computing or signal processing system. Each input signal is first amplified in a four-junction logic gate driving a Suzuki stack, which, in turn, drives a highly sensitive CMOS comparator that raises the signal to volt level. Such amplifiers are provided for the address, data, read, and write inputs to the CMOS memory. Output currents from the memory cells are detected by ultrafast four-junction logic gates providing 5-mV output signals; an equivalent arrangement was used for the delay tests. The overall read delay is the access time, which we find to be about 400 ps. We extrapolate from the measured and calculated power dissipation in this partially accessed 64-kb memory to a fully accessed 64-kb memory and find the expected overall read power dissipation to be about 12 mW for operation at 1 GHz.</description><identifier>ISSN: 1051-8223</identifier><identifier>EISSN: 1558-2515</identifier><identifier>DOI: 10.1109/TASC.2012.2230294</identifier><identifier>CODEN: ITASE9</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>4 K CMOS ; Access time ; Amplifiers ; Applied sciences ; Chip formation ; Chips ; Circuit properties ; CMOS ; CMOS integrated circuits ; Delay ; Design. Technologies. Operation analysis. Testing ; Digital circuits ; Electric, optical and optoelectronic circuits ; Electronic circuits ; Electronics ; Exact sciences and technology ; high-speed interface ; hybrid memory ; Hybrid power systems ; Integrated circuits ; Integrated circuits by function (including memories and processors) ; Logic ; Logic gates ; Power dissipation ; Product introduction ; Random access memory ; Semiconductor device measurement ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Signal processing ; Voltage measurement</subject><ispartof>IEEE transactions on applied superconductivity, 2013-06, Vol.23 (3), p.1700504-1700504</ispartof><rights>2014 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Jun 2013</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c356t-fd3db144dad3ba6be910411454313d7001cf5bd47009f85f45d5d83dfbe4de663</citedby><cites>FETCH-LOGICAL-c356t-fd3db144dad3ba6be910411454313d7001cf5bd47009f85f45d5d83dfbe4de663</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6363561$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,314,780,784,789,790,796,23930,23931,25140,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6363561$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=27529944$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Van Duzer, T.</creatorcontrib><creatorcontrib>Lizhen Zheng</creatorcontrib><creatorcontrib>Whiteley, S. R.</creatorcontrib><creatorcontrib>Kim, Hoki</creatorcontrib><creatorcontrib>Jaewoo Kim</creatorcontrib><creatorcontrib>Xiaofan Meng</creatorcontrib><creatorcontrib>Ortlepp, T.</creatorcontrib><title>64-kb Hybrid Josephson-CMOS 4 Kelvin RAM With 400 ps Access Time and 12 mW Read Power</title><title>IEEE transactions on applied superconductivity</title><addtitle>TASC</addtitle><description>We have designed, simulated, fabricated, and tested a 64-kb hybrid Josephson-CMOS memory using a 5 mm × 5 mm Josephson interface chip and a 2.0 × 1.5 mm CMOS chip. The Josephson chip uses the Hypres 4.5 kA/cm 2 niobium technology and the CMOS chip is made using the TSMC 65-nm technology. The chips are connected using short wire bonds in a piggy-back package. The chip sizes and pad layouts have been constrained to allow testing in our wideband American Cryoprobe Model BCP-2 test probe to measure ultrashort delays. The test signals of 5-mV amplitude are chosen to represent the signals that would be supplied to the memory in a digital computing or signal processing system. Each input signal is first amplified in a four-junction logic gate driving a Suzuki stack, which, in turn, drives a highly sensitive CMOS comparator that raises the signal to volt level. Such amplifiers are provided for the address, data, read, and write inputs to the CMOS memory. Output currents from the memory cells are detected by ultrafast four-junction logic gates providing 5-mV output signals; an equivalent arrangement was used for the delay tests. The overall read delay is the access time, which we find to be about 400 ps. We extrapolate from the measured and calculated power dissipation in this partially accessed 64-kb memory to a fully accessed 64-kb memory and find the expected overall read power dissipation to be about 12 mW for operation at 1 GHz.</description><subject>4 K CMOS</subject><subject>Access time</subject><subject>Amplifiers</subject><subject>Applied sciences</subject><subject>Chip formation</subject><subject>Chips</subject><subject>Circuit properties</subject><subject>CMOS</subject><subject>CMOS integrated circuits</subject><subject>Delay</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Digital circuits</subject><subject>Electric, optical and optoelectronic circuits</subject><subject>Electronic circuits</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>high-speed interface</subject><subject>hybrid memory</subject><subject>Hybrid power systems</subject><subject>Integrated circuits</subject><subject>Integrated circuits by function (including memories and processors)</subject><subject>Logic</subject><subject>Logic gates</subject><subject>Power dissipation</subject><subject>Product introduction</subject><subject>Random access memory</subject><subject>Semiconductor device measurement</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Signal processing</subject><subject>Voltage measurement</subject><issn>1051-8223</issn><issn>1558-2515</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpdkE1LAzEQhhdRUKs_QLwERPCyNZNM0s2xFL8tFa14DNnNLK5ud2vSKv57t7Z48DQD88zLy5MkR8D7ANycT4dPo77gIPpCSC4MbiV7oFSWCgVqu9u5gjTrbrvJfoxvnANmqPaSZ43pe86uv_NQeXbbRpq_xrZJR-PJE0N2R_Vn1bDH4Zi9VItXhpyzeWTDoqAY2bSaEXONZyDY7IU9kvPsof2icJDslK6OdLiZveT58mI6uk7vJ1c3o-F9WkilF2nppc8B0Tsvc6dzMsARABVKkH7QlSxKlXvsNlNmqkTllc-kL3NCT1rLXnK2zp2H9mNJcWFnVSyorl1D7TJakGhQSvOLnvxD39plaLp2FsRAaK1BmY6CNVWENsZApZ2HaubCtwVuV6LtSrRdibYb0d3P6SbZxcLVZXBNUcW_RzFQwhhcccdrriKiv7OWunMB8gcie4FR</recordid><startdate>20130601</startdate><enddate>20130601</enddate><creator>Van Duzer, T.</creator><creator>Lizhen Zheng</creator><creator>Whiteley, S. 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R. ; Kim, Hoki ; Jaewoo Kim ; Xiaofan Meng ; Ortlepp, T.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c356t-fd3db144dad3ba6be910411454313d7001cf5bd47009f85f45d5d83dfbe4de663</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>4 K CMOS</topic><topic>Access time</topic><topic>Amplifiers</topic><topic>Applied sciences</topic><topic>Chip formation</topic><topic>Chips</topic><topic>Circuit properties</topic><topic>CMOS</topic><topic>CMOS integrated circuits</topic><topic>Delay</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Digital circuits</topic><topic>Electric, optical and optoelectronic circuits</topic><topic>Electronic circuits</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>high-speed interface</topic><topic>hybrid memory</topic><topic>Hybrid power systems</topic><topic>Integrated circuits</topic><topic>Integrated circuits by function (including memories and processors)</topic><topic>Logic</topic><topic>Logic gates</topic><topic>Power dissipation</topic><topic>Product introduction</topic><topic>Random access memory</topic><topic>Semiconductor device measurement</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Signal processing</topic><topic>Voltage measurement</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Van Duzer, T.</creatorcontrib><creatorcontrib>Lizhen Zheng</creatorcontrib><creatorcontrib>Whiteley, S. R.</creatorcontrib><creatorcontrib>Kim, Hoki</creatorcontrib><creatorcontrib>Jaewoo Kim</creatorcontrib><creatorcontrib>Xiaofan Meng</creatorcontrib><creatorcontrib>Ortlepp, T.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE transactions on applied superconductivity</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Van Duzer, T.</au><au>Lizhen Zheng</au><au>Whiteley, S. R.</au><au>Kim, Hoki</au><au>Jaewoo Kim</au><au>Xiaofan Meng</au><au>Ortlepp, T.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>64-kb Hybrid Josephson-CMOS 4 Kelvin RAM With 400 ps Access Time and 12 mW Read Power</atitle><jtitle>IEEE transactions on applied superconductivity</jtitle><stitle>TASC</stitle><date>2013-06-01</date><risdate>2013</risdate><volume>23</volume><issue>3</issue><spage>1700504</spage><epage>1700504</epage><pages>1700504-1700504</pages><issn>1051-8223</issn><eissn>1558-2515</eissn><coden>ITASE9</coden><abstract>We have designed, simulated, fabricated, and tested a 64-kb hybrid Josephson-CMOS memory using a 5 mm × 5 mm Josephson interface chip and a 2.0 × 1.5 mm CMOS chip. The Josephson chip uses the Hypres 4.5 kA/cm 2 niobium technology and the CMOS chip is made using the TSMC 65-nm technology. The chips are connected using short wire bonds in a piggy-back package. The chip sizes and pad layouts have been constrained to allow testing in our wideband American Cryoprobe Model BCP-2 test probe to measure ultrashort delays. The test signals of 5-mV amplitude are chosen to represent the signals that would be supplied to the memory in a digital computing or signal processing system. Each input signal is first amplified in a four-junction logic gate driving a Suzuki stack, which, in turn, drives a highly sensitive CMOS comparator that raises the signal to volt level. Such amplifiers are provided for the address, data, read, and write inputs to the CMOS memory. Output currents from the memory cells are detected by ultrafast four-junction logic gates providing 5-mV output signals; an equivalent arrangement was used for the delay tests. The overall read delay is the access time, which we find to be about 400 ps. We extrapolate from the measured and calculated power dissipation in this partially accessed 64-kb memory to a fully accessed 64-kb memory and find the expected overall read power dissipation to be about 12 mW for operation at 1 GHz.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/TASC.2012.2230294</doi><tpages>1</tpages></addata></record> |
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subjects | 4 K CMOS Access time Amplifiers Applied sciences Chip formation Chips Circuit properties CMOS CMOS integrated circuits Delay Design. Technologies. Operation analysis. Testing Digital circuits Electric, optical and optoelectronic circuits Electronic circuits Electronics Exact sciences and technology high-speed interface hybrid memory Hybrid power systems Integrated circuits Integrated circuits by function (including memories and processors) Logic Logic gates Power dissipation Product introduction Random access memory Semiconductor device measurement Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Signal processing Voltage measurement |
title | 64-kb Hybrid Josephson-CMOS 4 Kelvin RAM With 400 ps Access Time and 12 mW Read Power |
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