CO2 laser cutting and ablative etching for the fabrication of paper-based devices
We describe a method for fabricating paper-based microfluidic devices using a commercially available CO2 laser system. The method is versatile and allows for controlled through-cutting and ablative etching of nitrocellulose substrates. In addition, the laser system can cut a variety of components th...
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| Veröffentlicht in: | Journal of micromechanics and microengineering 2013-06, Vol.23 (6) |
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| container_issue | 6 |
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| container_title | Journal of micromechanics and microengineering |
| container_volume | 23 |
| creator | Spicar-Mihalic, P Toley, B Houghtaling, J Liang, T Yager, P Fu, E |
| description | We describe a method for fabricating paper-based microfluidic devices using a commercially available CO2 laser system. The method is versatile and allows for controlled through-cutting and ablative etching of nitrocellulose substrates. In addition, the laser system can cut a variety of components that are useful in the fabrication of paper-based devices, including cellulose wicking pads, glass fiber source pads and Mylar-based substrates for the device housing. |
| doi_str_mv | 10.1088/0960-1317/23/6/067003 |
| format | Article |
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The method is versatile and allows for controlled through-cutting and ablative etching of nitrocellulose substrates. In addition, the laser system can cut a variety of components that are useful in the fabrication of paper-based devices, including cellulose wicking pads, glass fiber source pads and Mylar-based substrates for the device housing.</description><identifier>ISSN: 0960-1317</identifier><identifier>EISSN: 1361-6439</identifier><identifier>DOI: 10.1088/0960-1317/23/6/067003</identifier><identifier>CODEN: JMMIEZ</identifier><language>eng</language><publisher>Bristol: IOP Publishing</publisher><subject>Applied sciences ; Exact sciences and technology ; laser cutting and ablative etching ; microfabrication ; Miscellaneous ; Paper, paperboard, non wovens ; paper-based devices ; Polymer industry, paints, wood ; Wood. Paper. Non wovens</subject><ispartof>Journal of micromechanics and microengineering, 2013-06, Vol.23 (6)</ispartof><rights>2013 IOP Publishing Ltd</rights><rights>2014 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://iopscience.iop.org/article/10.1088/0960-1317/23/6/067003/pdf$$EPDF$$P50$$Giop$$H</linktopdf><link.rule.ids>314,776,780,27903,27904,53824,53871</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=27442670$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Spicar-Mihalic, P</creatorcontrib><creatorcontrib>Toley, B</creatorcontrib><creatorcontrib>Houghtaling, J</creatorcontrib><creatorcontrib>Liang, T</creatorcontrib><creatorcontrib>Yager, P</creatorcontrib><creatorcontrib>Fu, E</creatorcontrib><title>CO2 laser cutting and ablative etching for the fabrication of paper-based devices</title><title>Journal of micromechanics and microengineering</title><addtitle>JMM</addtitle><addtitle>J. Micromech. Microeng</addtitle><description>We describe a method for fabricating paper-based microfluidic devices using a commercially available CO2 laser system. The method is versatile and allows for controlled through-cutting and ablative etching of nitrocellulose substrates. In addition, the laser system can cut a variety of components that are useful in the fabrication of paper-based devices, including cellulose wicking pads, glass fiber source pads and Mylar-based substrates for the device housing.</description><subject>Applied sciences</subject><subject>Exact sciences and technology</subject><subject>laser cutting and ablative etching</subject><subject>microfabrication</subject><subject>Miscellaneous</subject><subject>Paper, paperboard, non wovens</subject><subject>paper-based devices</subject><subject>Polymer industry, paints, wood</subject><subject>Wood. Paper. 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Paper. Non wovens</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Spicar-Mihalic, P</creatorcontrib><creatorcontrib>Toley, B</creatorcontrib><creatorcontrib>Houghtaling, J</creatorcontrib><creatorcontrib>Liang, T</creatorcontrib><creatorcontrib>Yager, P</creatorcontrib><creatorcontrib>Fu, E</creatorcontrib><collection>Pascal-Francis</collection><jtitle>Journal of micromechanics and microengineering</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Spicar-Mihalic, P</au><au>Toley, B</au><au>Houghtaling, J</au><au>Liang, T</au><au>Yager, P</au><au>Fu, E</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>CO2 laser cutting and ablative etching for the fabrication of paper-based devices</atitle><jtitle>Journal of micromechanics and microengineering</jtitle><stitle>JMM</stitle><addtitle>J. Micromech. 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| ispartof | Journal of micromechanics and microengineering, 2013-06, Vol.23 (6) |
| issn | 0960-1317 1361-6439 |
| language | eng |
| recordid | cdi_pascalfrancis_primary_27442670 |
| source | Institute of Physics Journals |
| subjects | Applied sciences Exact sciences and technology laser cutting and ablative etching microfabrication Miscellaneous Paper, paperboard, non wovens paper-based devices Polymer industry, paints, wood Wood. Paper. Non wovens |
| title | CO2 laser cutting and ablative etching for the fabrication of paper-based devices |
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