Large-area compatible fabrication and encapsulation of inkjet-printed humidity sensors on flexible foils with integrated thermal compensation

This work presents the simultaneous fabrication of ambient relative humidity (RH) and temperature sensors arrays, inkjet-printed on flexible substrates and subsequently encapsulated at foil level. These sensors are based on planar interdigitated capacitors with an inkjet-printed sensing layer and me...

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Veröffentlicht in:Journal of micromechanics and microengineering 2013-02, Vol.23 (2), p.25012-11
Hauptverfasser: Molina-Lopez, F, Quintero, A Vásquez, Mattana, G, Briand, D, de Rooij, N F
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Sprache:eng
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