Large-area compatible fabrication and encapsulation of inkjet-printed humidity sensors on flexible foils with integrated thermal compensation
This work presents the simultaneous fabrication of ambient relative humidity (RH) and temperature sensors arrays, inkjet-printed on flexible substrates and subsequently encapsulated at foil level. These sensors are based on planar interdigitated capacitors with an inkjet-printed sensing layer and me...
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Veröffentlicht in: | Journal of micromechanics and microengineering 2013-02, Vol.23 (2), p.25012-11 |
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Sprache: | eng |
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