A multivariate parameter trace analysis for online fault detection in a semiconductor etch tool

The objective of this paper is to develop a wafer-by-wafer fault detection model for a semiconductor etch tool operating in a worksite situation in which the tool parameter traces are correlated and drift slowly from an initial recipe setting. Process drift is a common occurrence in many processes b...

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Veröffentlicht in:	International journal of production research 2012-12, Vol.50 (23), p.6639-6654
Hauptverfasser:	Ko, Jong Myoung, Kim, Chang Ouk
Format:	Artikel
Sprache:	eng
Schlagworte:	Algorithms Applied sciences Computer science control theory systems Control theory. Systems Drift dynamic time warping Electronics Etching Exact sciences and technology Fault detection Fault diagnosis Industrial metrology. Testing Kalman filtering Mathematical models Mechanical engineering. Machine design Microelectronic fabrication (materials and surfaces technology) Modelling and identification Multivariate analysis Operations research Optimization recursive T Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices semiconductor manufacturing tool Semiconductors Studies tool fault detection tool parameter traces update
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