Packaging Effects of Multiple X-Band SiGe LNAs Embedded in an Organic LCP Substrate
Interconnects in radio frequency (RF) packages have a strong tendency to deteriorate RF performance, especially in high-frequency systems. In this paper, comparison is made between the wirebonded and embedded flip-chip packages. X-band silicon-germanium low-noise amplifiers are used to evaluate the...
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| Veröffentlicht in: | IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2012-08, Vol.2 (8), p.1351-1360 |
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| container_title | IEEE transactions on components, packaging, and manufacturing technology (2011) |
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| creator | Poh, Chung Hang John Patterson, C. E. Bhattacharya, S. K. Philips, S. D. Lourenco, N. E. Cressler, J. D. Papapolymerou, J. |
| description | Interconnects in radio frequency (RF) packages have a strong tendency to deteriorate RF performance, especially in high-frequency systems. In this paper, comparison is made between the wirebonded and embedded flip-chip packages. X-band silicon-germanium low-noise amplifiers are used to evaluate the performance of these interconnects. Measured results show that the embedded flip-chip packages have better RF performance than the wirebonded packages for X-band applications. At 9.5 GHz, the flip-chip interconnects contribute only 0.4 dB of insertion loss, while the wirebond interconnects contribute 2.2 dB of insertion loss. The flip-chip and wirebond interconnects are modeled and validated against measured results from 8 to 20 GHz. For the first time, multiple dies are put together in a single liquid crystal polymer package to compare the packaging effects, and to demonstrate the feasibility of embedding multiple dies within a single package for highly integrated solutions. |
| doi_str_mv | 10.1109/TCPMT.2012.2191152 |
| format | Article |
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E. ; Bhattacharya, S. K. ; Philips, S. D. ; Lourenco, N. E. ; Cressler, J. D. ; Papapolymerou, J.</creator><creatorcontrib>Poh, Chung Hang John ; Patterson, C. E. ; Bhattacharya, S. K. ; Philips, S. D. ; Lourenco, N. E. ; Cressler, J. D. ; Papapolymerou, J.</creatorcontrib><description>Interconnects in radio frequency (RF) packages have a strong tendency to deteriorate RF performance, especially in high-frequency systems. In this paper, comparison is made between the wirebonded and embedded flip-chip packages. X-band silicon-germanium low-noise amplifiers are used to evaluate the performance of these interconnects. Measured results show that the embedded flip-chip packages have better RF performance than the wirebonded packages for X-band applications. At 9.5 GHz, the flip-chip interconnects contribute only 0.4 dB of insertion loss, while the wirebond interconnects contribute 2.2 dB of insertion loss. The flip-chip and wirebond interconnects are modeled and validated against measured results from 8 to 20 GHz. For the first time, multiple dies are put together in a single liquid crystal polymer package to compare the packaging effects, and to demonstrate the feasibility of embedding multiple dies within a single package for highly integrated solutions.</description><identifier>ISSN: 2156-3950</identifier><identifier>EISSN: 2156-3985</identifier><identifier>DOI: 10.1109/TCPMT.2012.2191152</identifier><identifier>CODEN: ITCPC8</identifier><language>eng</language><publisher>Piscataway, NJ: IEEE</publisher><subject>Amplifiers ; Applied sciences ; Circuit properties ; Circuits of signal characteristics conditioning (including delay circuits) ; Coplanar waveguides ; Design. Technologies. Operation analysis. Testing ; Dies ; Electric, optical and optoelectronic circuits ; Electronic circuits ; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics ; Electronics ; Exact sciences and technology ; Gold ; Integrated circuit interconnections ; Integrated circuit packaging ; Integrated circuits ; liquid crystal polymer ; Liquid crystal polymers ; low-noise amplifiers ; Noise levels ; Packages ; Packaging ; Power combiners ; Radio frequencies ; Radio frequency ; RF modeling ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; SiGe BiCMOS ; Silicon germanides ; Silicon germanium ; Software ; Substrates ; wilkinson power divider ; X-band</subject><ispartof>IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-08, Vol.2 (8), p.1351-1360</ispartof><rights>2015 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Aug 2012</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c358t-36bb9fcd59e4fdc076d35bc60480fb9924083c77e4be337bb180f5affee2081f3</citedby><cites>FETCH-LOGICAL-c358t-36bb9fcd59e4fdc076d35bc60480fb9924083c77e4be337bb180f5affee2081f3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6189842$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6189842$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=26323804$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Poh, Chung Hang John</creatorcontrib><creatorcontrib>Patterson, C. E.</creatorcontrib><creatorcontrib>Bhattacharya, S. K.</creatorcontrib><creatorcontrib>Philips, S. D.</creatorcontrib><creatorcontrib>Lourenco, N. E.</creatorcontrib><creatorcontrib>Cressler, J. D.</creatorcontrib><creatorcontrib>Papapolymerou, J.</creatorcontrib><title>Packaging Effects of Multiple X-Band SiGe LNAs Embedded in an Organic LCP Substrate</title><title>IEEE transactions on components, packaging, and manufacturing technology (2011)</title><addtitle>TCPMT</addtitle><description>Interconnects in radio frequency (RF) packages have a strong tendency to deteriorate RF performance, especially in high-frequency systems. In this paper, comparison is made between the wirebonded and embedded flip-chip packages. X-band silicon-germanium low-noise amplifiers are used to evaluate the performance of these interconnects. Measured results show that the embedded flip-chip packages have better RF performance than the wirebonded packages for X-band applications. At 9.5 GHz, the flip-chip interconnects contribute only 0.4 dB of insertion loss, while the wirebond interconnects contribute 2.2 dB of insertion loss. The flip-chip and wirebond interconnects are modeled and validated against measured results from 8 to 20 GHz. For the first time, multiple dies are put together in a single liquid crystal polymer package to compare the packaging effects, and to demonstrate the feasibility of embedding multiple dies within a single package for highly integrated solutions.</description><subject>Amplifiers</subject><subject>Applied sciences</subject><subject>Circuit properties</subject><subject>Circuits of signal characteristics conditioning (including delay circuits)</subject><subject>Coplanar waveguides</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Dies</subject><subject>Electric, optical and optoelectronic circuits</subject><subject>Electronic circuits</subject><subject>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Gold</subject><subject>Integrated circuit interconnections</subject><subject>Integrated circuit packaging</subject><subject>Integrated circuits</subject><subject>liquid crystal polymer</subject><subject>Liquid crystal polymers</subject><subject>low-noise amplifiers</subject><subject>Noise levels</subject><subject>Packages</subject><subject>Packaging</subject><subject>Power combiners</subject><subject>Radio frequencies</subject><subject>Radio frequency</subject><subject>RF modeling</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>SiGe BiCMOS</subject><subject>Silicon germanides</subject><subject>Silicon germanium</subject><subject>Software</subject><subject>Substrates</subject><subject>wilkinson power divider</subject><subject>X-band</subject><issn>2156-3950</issn><issn>2156-3985</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2012</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpdkE1LAzEQhhdRUGr_gF4CInjZmo_NbnKspX5Aq4VW8LYk2UmJbndrsnvw35va0oNzmWHmmZeXN0muCB4RguX9arKYr0YUEzqiRBLC6UlyQQnPUyYFPz3OHJ8nwxA-cSwucIHZRbJcKPOl1q5Zo6m1YLqAWovmfd25bQ3oI31QTYWW7gnQ7HUc0HSjoaqgQq5BqkFvfq0aZ9BsskDLXofOqw4ukzOr6gDDQx8k74_T1eQ5nb09vUzGs9QwLrqU5VpLayouIbOVwUVeMa5NjjOBrZaSZlgwUxSQaWCs0JrEPVfRJVAsiGWD5G6vu_Xtdw-hKzcuGKhr1UDbh5JgJmguRSEievMP_Wx730R3O4rQHAteRIruKePbEDzYcuvdRvmfCJW7qMu_qMtd1OUh6vh0e5BWwajaetUYF46fNGeUCZxF7nrPOQA4nnMipMgo-wWs6ISA</recordid><startdate>20120801</startdate><enddate>20120801</enddate><creator>Poh, Chung Hang John</creator><creator>Patterson, C. 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Passive components, printed wiring boards, connectics</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Gold</topic><topic>Integrated circuit interconnections</topic><topic>Integrated circuit packaging</topic><topic>Integrated circuits</topic><topic>liquid crystal polymer</topic><topic>Liquid crystal polymers</topic><topic>low-noise amplifiers</topic><topic>Noise levels</topic><topic>Packages</topic><topic>Packaging</topic><topic>Power combiners</topic><topic>Radio frequencies</topic><topic>Radio frequency</topic><topic>RF modeling</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. 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| subjects | Amplifiers Applied sciences Circuit properties Circuits of signal characteristics conditioning (including delay circuits) Coplanar waveguides Design. Technologies. Operation analysis. Testing Dies Electric, optical and optoelectronic circuits Electronic circuits Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Gold Integrated circuit interconnections Integrated circuit packaging Integrated circuits liquid crystal polymer Liquid crystal polymers low-noise amplifiers Noise levels Packages Packaging Power combiners Radio frequencies Radio frequency RF modeling Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices SiGe BiCMOS Silicon germanides Silicon germanium Software Substrates wilkinson power divider X-band |
| title | Packaging Effects of Multiple X-Band SiGe LNAs Embedded in an Organic LCP Substrate |
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