A Mobile 3-D Display Processor With A Bandwidth-Saving Subdivider
A mobile 3-D display processor with a subdivider is presented for higher visual quality on handhelds. By combining a subdivision technique with a 3-D display, the processor can support viewers see realistic smooth surfaces in the air. However, both the subdivision and the 3-D display processes requi...
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| Veröffentlicht in: | IEEE transactions on very large scale integration (VLSI) systems 2012-06, Vol.20 (6), p.1082-1093 |
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| container_title | IEEE transactions on very large scale integration (VLSI) systems |
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| creator | KIM, Seok-Hoon YOON, Sung-Eui CHUNG, Sang-Hye KIM, Young-Jun KIM, Hong-Yun CHUNG, Kyusik KIM, Lee-Sup |
| description | A mobile 3-D display processor with a subdivider is presented for higher visual quality on handhelds. By combining a subdivision technique with a 3-D display, the processor can support viewers see realistic smooth surfaces in the air. However, both the subdivision and the 3-D display processes require a high number of memory operations to mobile memory architecture. Therefore, we make efforts to save the bandwidth between the processor and off-chip memory. In the subdivider, we propose a recomputing based depth-first scheme that has much smaller working set than prior works. The proposed scheme achieves about 100:1 bandwidth reduction over the prior subdivision methods. Also the designed 3-D display engine reduces the bandwidth to 27% by reordering the operation sequence of the 3-D display process. This bandwidth saving translates into reductions of off-chip access energy and time. Consequently the overall bandwidth of both the subdivision and the 3-D display processes is affordable to a commercial mobile bus. In addition to saving bandwidth, our work provides enough visual quality and performance. Overall the 3-D display engine achieves 325 fps for 480×320 display resolution. |
| doi_str_mv | 10.1109/TVLSI.2011.2150253 |
| format | Article |
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By combining a subdivision technique with a 3-D display, the processor can support viewers see realistic smooth surfaces in the air. However, both the subdivision and the 3-D display processes require a high number of memory operations to mobile memory architecture. Therefore, we make efforts to save the bandwidth between the processor and off-chip memory. In the subdivider, we propose a recomputing based depth-first scheme that has much smaller working set than prior works. The proposed scheme achieves about 100:1 bandwidth reduction over the prior subdivision methods. Also the designed 3-D display engine reduces the bandwidth to 27% by reordering the operation sequence of the 3-D display process. This bandwidth saving translates into reductions of off-chip access energy and time. Consequently the overall bandwidth of both the subdivision and the 3-D display processes is affordable to a commercial mobile bus. 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Solid state devices ; Subdivisions ; Surface treatment ; System-on-a-chip ; Three dimensional ; Three dimensional displays ; Very large scale integration ; Visual</subject><ispartof>IEEE transactions on very large scale integration (VLSI) systems, 2012-06, Vol.20 (6), p.1082-1093</ispartof><rights>2015 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. 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By combining a subdivision technique with a 3-D display, the processor can support viewers see realistic smooth surfaces in the air. However, both the subdivision and the 3-D display processes require a high number of memory operations to mobile memory architecture. Therefore, we make efforts to save the bandwidth between the processor and off-chip memory. In the subdivider, we propose a recomputing based depth-first scheme that has much smaller working set than prior works. The proposed scheme achieves about 100:1 bandwidth reduction over the prior subdivision methods. Also the designed 3-D display engine reduces the bandwidth to 27% by reordering the operation sequence of the 3-D display process. This bandwidth saving translates into reductions of off-chip access energy and time. Consequently the overall bandwidth of both the subdivision and the 3-D display processes is affordable to a commercial mobile bus. In addition to saving bandwidth, our work provides enough visual quality and performance. Overall the 3-D display engine achieves 325 fps for 480×320 display resolution.</description><subject>3-D displays</subject><subject>Applied sciences</subject><subject>Bandwidth</subject><subject>computer graphics</subject><subject>Data structures</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</subject><subject>Electronics</subject><subject>Engines</subject><subject>Exact sciences and technology</subject><subject>Integrated circuits</subject><subject>Integrated circuits by function (including memories and processors)</subject><subject>Memory management</subject><subject>Microprocessors</subject><subject>Mobile communication</subject><subject>multimedia systems</subject><subject>Reduction</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Subdivisions</subject><subject>Surface treatment</subject><subject>System-on-a-chip</subject><subject>Three dimensional</subject><subject>Three dimensional displays</subject><subject>Very large scale integration</subject><subject>Visual</subject><issn>1063-8210</issn><issn>1557-9999</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2012</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpdkN9LwzAQgIsoOKf_gL4URPClM5c0bfpYN38MJgqb-hjSJHUZXTuTdrL_3syNPXgvd3DfHXdfEFwCGgCg7G72MZmOBxgBDDBQhCk5CnpAaRplPo59jRISMQzoNDhzboEQxHGGekGehy9NYSodkmgUjoxbVWITvtlGaucaG36adh7m4b2o1Y9R7TyairWpv8JpVyizNkrb8-CkFJXTF_vcD94fH2bD52jy-jQe5pNIEsraCKvEn6cFLSRLE6HTuCQlRoiloKXQSialjBnJVAkYVIFASQQZE5j4d3BckH5wu9u7ss13p13Ll8ZJXVWi1k3nOCQpkDhlLPXo9T900XS29tdxQODlUMyIp_COkrZxzuqSr6xZCrvxEN9a5X9W-dYq31v1Qzf71cJJUZVW1NK4wySmWUxjmnnuascZrfWhTVP_YZKQX3WIfbQ</recordid><startdate>20120601</startdate><enddate>20120601</enddate><creator>KIM, Seok-Hoon</creator><creator>YOON, Sung-Eui</creator><creator>CHUNG, Sang-Hye</creator><creator>KIM, Young-Jun</creator><creator>KIM, Hong-Yun</creator><creator>CHUNG, Kyusik</creator><creator>KIM, Lee-Sup</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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By combining a subdivision technique with a 3-D display, the processor can support viewers see realistic smooth surfaces in the air. However, both the subdivision and the 3-D display processes require a high number of memory operations to mobile memory architecture. Therefore, we make efforts to save the bandwidth between the processor and off-chip memory. In the subdivider, we propose a recomputing based depth-first scheme that has much smaller working set than prior works. The proposed scheme achieves about 100:1 bandwidth reduction over the prior subdivision methods. Also the designed 3-D display engine reduces the bandwidth to 27% by reordering the operation sequence of the 3-D display process. This bandwidth saving translates into reductions of off-chip access energy and time. Consequently the overall bandwidth of both the subdivision and the 3-D display processes is affordable to a commercial mobile bus. 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| ispartof | IEEE transactions on very large scale integration (VLSI) systems, 2012-06, Vol.20 (6), p.1082-1093 |
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| subjects | 3-D displays Applied sciences Bandwidth computer graphics Data structures Design. Technologies. Operation analysis. Testing Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Engines Exact sciences and technology Integrated circuits Integrated circuits by function (including memories and processors) Memory management Microprocessors Mobile communication multimedia systems Reduction Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Subdivisions Surface treatment System-on-a-chip Three dimensional Three dimensional displays Very large scale integration Visual |
| title | A Mobile 3-D Display Processor With A Bandwidth-Saving Subdivider |
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