Reduction of Thermal Resistance of High-Power Amplifiers by Carbon Fiber-Reinforced Carbon Composite-Based Package
This paper deals with the thermal design of an electronics package and a demonstration of reduced thermal resistance for high-power amplifiers (HPAs). The focus is package internal thermal management. A carbon fiber-reinforced carbon composite- (C/C composite) based heat sink is proposed as a means...
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| Veröffentlicht in: | IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2012-01, Vol.2 (1), p.95-101 |
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| container_title | IEEE transactions on components, packaging, and manufacturing technology (2011) |
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| creator | Kuroda, N. Wakejima, A. Tanomura, M. Ota, K. Ando, Y. Nakayama, T. Okamoto, Y. Matsunaga, K. Miyamoto, H. |
| description | This paper deals with the thermal design of an electronics package and a demonstration of reduced thermal resistance for high-power amplifiers (HPAs). The focus is package internal thermal management. A carbon fiber-reinforced carbon composite- (C/C composite) based heat sink is proposed as a means of enhancement over the more conventional CuMo material. The C/C composite has anisotropic thermal properties. Thermal performance of the material with anisotropic thermal properties depends strongly on taking advantage of superior properties in the desired directions. Finite-element analysis is performed to determine the correct orientation of the C/C composite material with anisotropic thermal conductivities to minimize thermal resistance. A 32% reduction in thermal resistance of the HPA has been predicted in the initial simulation. A package incorporating the C/C composite material is built with the optimal orientation of thermal anisotropy obtained by numerical simulations. A 20% reduction in thermal resistance has been successfully obtained by surface temperature measurements for the HPA with the C/C composite material. The difference between numerical (32%) and experimental results (20%) is well explained by the difference in boundary conditions at the package base. Also, nonlinearity in thermal resistance is explained by taking account of temperature dependence of semiconductor materials, such as SiC and GaN. |
| doi_str_mv | 10.1109/TCPMT.2011.2169673 |
| format | Article |
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The focus is package internal thermal management. A carbon fiber-reinforced carbon composite- (C/C composite) based heat sink is proposed as a means of enhancement over the more conventional CuMo material. The C/C composite has anisotropic thermal properties. Thermal performance of the material with anisotropic thermal properties depends strongly on taking advantage of superior properties in the desired directions. Finite-element analysis is performed to determine the correct orientation of the C/C composite material with anisotropic thermal conductivities to minimize thermal resistance. A 32% reduction in thermal resistance of the HPA has been predicted in the initial simulation. A package incorporating the C/C composite material is built with the optimal orientation of thermal anisotropy obtained by numerical simulations. A 20% reduction in thermal resistance has been successfully obtained by surface temperature measurements for the HPA with the C/C composite material. The difference between numerical (32%) and experimental results (20%) is well explained by the difference in boundary conditions at the package base. Also, nonlinearity in thermal resistance is explained by taking account of temperature dependence of semiconductor materials, such as SiC and GaN.</description><identifier>ISSN: 2156-3950</identifier><identifier>EISSN: 2156-3985</identifier><identifier>DOI: 10.1109/TCPMT.2011.2169673</identifier><identifier>CODEN: ITCPC8</identifier><language>eng</language><publisher>Piscataway, NJ: IEEE</publisher><subject>Amplifiers ; Applied sciences ; Carbon composite ; Circuit properties ; Composite materials ; Conductivity ; Design. Technologies. Operation analysis. Testing ; Electric, optical and optoelectronic circuits ; Electrical engineering. Electrical power engineering ; Electronic circuits ; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics ; Electronic packaging thermal management ; Electronics ; Exact sciences and technology ; Heat sinks ; high-power amplifier ; Integrated circuits ; packaging ; Power electronics, power supplies ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Studies ; Temperature measurement ; thermal anisotropy ; Thermal conductivity ; Thermal energy ; Thermal resistance</subject><ispartof>IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-01, Vol.2 (1), p.95-101</ispartof><rights>2015 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Jan 2012</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c325t-19651edbf32ee94c402b52e9190d43fb49adff9750109f9443783e1c7ea4ed533</citedby><cites>FETCH-LOGICAL-c325t-19651edbf32ee94c402b52e9190d43fb49adff9750109f9443783e1c7ea4ed533</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6081915$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,4010,27900,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6081915$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=25512678$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Kuroda, N.</creatorcontrib><creatorcontrib>Wakejima, A.</creatorcontrib><creatorcontrib>Tanomura, M.</creatorcontrib><creatorcontrib>Ota, K.</creatorcontrib><creatorcontrib>Ando, Y.</creatorcontrib><creatorcontrib>Nakayama, T.</creatorcontrib><creatorcontrib>Okamoto, Y.</creatorcontrib><creatorcontrib>Matsunaga, K.</creatorcontrib><creatorcontrib>Miyamoto, H.</creatorcontrib><title>Reduction of Thermal Resistance of High-Power Amplifiers by Carbon Fiber-Reinforced Carbon Composite-Based Package</title><title>IEEE transactions on components, packaging, and manufacturing technology (2011)</title><addtitle>TCPMT</addtitle><description>This paper deals with the thermal design of an electronics package and a demonstration of reduced thermal resistance for high-power amplifiers (HPAs). The focus is package internal thermal management. A carbon fiber-reinforced carbon composite- (C/C composite) based heat sink is proposed as a means of enhancement over the more conventional CuMo material. The C/C composite has anisotropic thermal properties. Thermal performance of the material with anisotropic thermal properties depends strongly on taking advantage of superior properties in the desired directions. Finite-element analysis is performed to determine the correct orientation of the C/C composite material with anisotropic thermal conductivities to minimize thermal resistance. A 32% reduction in thermal resistance of the HPA has been predicted in the initial simulation. A package incorporating the C/C composite material is built with the optimal orientation of thermal anisotropy obtained by numerical simulations. A 20% reduction in thermal resistance has been successfully obtained by surface temperature measurements for the HPA with the C/C composite material. The difference between numerical (32%) and experimental results (20%) is well explained by the difference in boundary conditions at the package base. Also, nonlinearity in thermal resistance is explained by taking account of temperature dependence of semiconductor materials, such as SiC and GaN.</description><subject>Amplifiers</subject><subject>Applied sciences</subject><subject>Carbon composite</subject><subject>Circuit properties</subject><subject>Composite materials</subject><subject>Conductivity</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electric, optical and optoelectronic circuits</subject><subject>Electrical engineering. Electrical power engineering</subject><subject>Electronic circuits</subject><subject>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</subject><subject>Electronic packaging thermal management</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Heat sinks</subject><subject>high-power amplifier</subject><subject>Integrated circuits</subject><subject>packaging</subject><subject>Power electronics, power supplies</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Studies</subject><subject>Temperature measurement</subject><subject>thermal anisotropy</subject><subject>Thermal conductivity</subject><subject>Thermal energy</subject><subject>Thermal resistance</subject><issn>2156-3950</issn><issn>2156-3985</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2012</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kF9PwjAUxRujiQT5AvqyxPg47J91Wx9xETHRSMh8XrruFoobxXbE8O0tgvSlzek55978ELoleEwIFo9lMX8vxxQTMqYkFWnGLtCAEp7GTOT88vzm-BqNvF_jcHiOM8wGyC2g2ane2E1kdVSuwHWyjRbgje_lRsFBnZnlKp7bH3DRpNu2RhtwPqr3USFdHYJTU4OLF2A22joFzb9e2G5rvekhfpI-yHOpvuQSbtCVlq2H0ekeos_pc1nM4rePl9di8hYrRnkfE5FyAk2tGQUQiUowrTkFQQRuEqbrRMhGa5FxHBhokSQsyxkQlYFMoOGMDdH9sXfr7PcOfF-t7c5twsiKhAwnOKc4uOjRpZz13oGuts500u2DqTrgrf7wVge81QlvCD2cqqVXstUuoDL-nKScE5qGdYbo7ugzAHD-TnFOBOHsFzsIgvw</recordid><startdate>201201</startdate><enddate>201201</enddate><creator>Kuroda, N.</creator><creator>Wakejima, A.</creator><creator>Tanomura, M.</creator><creator>Ota, K.</creator><creator>Ando, Y.</creator><creator>Nakayama, T.</creator><creator>Okamoto, Y.</creator><creator>Matsunaga, K.</creator><creator>Miyamoto, H.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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Technologies. Operation analysis. Testing</topic><topic>Electric, optical and optoelectronic circuits</topic><topic>Electrical engineering. Electrical power engineering</topic><topic>Electronic circuits</topic><topic>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</topic><topic>Electronic packaging thermal management</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Heat sinks</topic><topic>high-power amplifier</topic><topic>Integrated circuits</topic><topic>packaging</topic><topic>Power electronics, power supplies</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. 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| ispartof | IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-01, Vol.2 (1), p.95-101 |
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| subjects | Amplifiers Applied sciences Carbon composite Circuit properties Composite materials Conductivity Design. Technologies. Operation analysis. Testing Electric, optical and optoelectronic circuits Electrical engineering. Electrical power engineering Electronic circuits Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronic packaging thermal management Electronics Exact sciences and technology Heat sinks high-power amplifier Integrated circuits packaging Power electronics, power supplies Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Studies Temperature measurement thermal anisotropy Thermal conductivity Thermal energy Thermal resistance |
| title | Reduction of Thermal Resistance of High-Power Amplifiers by Carbon Fiber-Reinforced Carbon Composite-Based Package |
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