Analysis of flow between a wafer and pad during CMP processes : Special section on chemical-mechanical planarization

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Veröffentlicht in:	Journal of electronic materials 1998, Vol.27 (10), p.1082-1087
Hauptverfasser:	ROGERS, C, COPPETA, J, RACZ, L, PHILIPOSSIAN, A, KAUFMAN, F. B, BRAMONO, D
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Electronics Exact sciences and technology Microelectronic fabrication (materials and surfaces technology) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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source	SpringerNature Journals
subjects	Applied sciences Electronics Exact sciences and technology Microelectronic fabrication (materials and surfaces technology) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
title	Analysis of flow between a wafer and pad during CMP processes : Special section on chemical-mechanical planarization
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