Nano-impact testing of TiFeN and TiFeMoN films for dynamic toughness evaluation
TiFeN and TiFeMoN films were deposited on silicon wafers by ion-beam-assisted deposition. Their mechanical properties were measured by nanoindentation (quasi-static) and nano-impact (dynamic) techniques. Nano-impact testing enabled assessment of their toughness and resistance to fatigue fracture und...
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| Veröffentlicht in: | Journal of physics. D, Applied physics Applied physics, 2011-03, Vol.44 (8), p.085301 |
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| container_issue | 8 |
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| container_title | Journal of physics. D, Applied physics |
| container_volume | 44 |
| creator | Beake, B D Vishnyakov, V M Colligon, J S |
| description | TiFeN and TiFeMoN films were deposited on silicon wafers by ion-beam-assisted deposition. Their mechanical properties were measured by nanoindentation (quasi-static) and nano-impact (dynamic) techniques. Nano-impact testing enabled assessment of their toughness and resistance to fatigue fracture under repetitive loading. At low impact forces, films with a higher resistance to plastic deformation (
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E
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) were much more resistant to the formation of cracks throughout the test. At higher impact forces, these films initially show impact resistance but with continued impacts they are unable to protect the Si substrate, performing as poorly as films with lower
H
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/
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and suffer delamination from the Si substrate over a large area. |
| doi_str_mv | 10.1088/0022-3727/44/8/085301 |
| format | Article |
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H
3
/
E
2
) were much more resistant to the formation of cracks throughout the test. At higher impact forces, these films initially show impact resistance but with continued impacts they are unable to protect the Si substrate, performing as poorly as films with lower
H
3
/
E
2
and suffer delamination from the Si substrate over a large area.</description><identifier>ISSN: 0022-3727</identifier><identifier>EISSN: 1361-6463</identifier><identifier>DOI: 10.1088/0022-3727/44/8/085301</identifier><identifier>CODEN: JPAPBE</identifier><language>eng</language><publisher>Bristol: IOP Publishing</publisher><subject>Condensed matter: structure, mechanical and thermal properties ; Exact sciences and technology ; Mechanical and acoustical properties ; Physical properties of thin films, nonelectronic ; Physics ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><ispartof>Journal of physics. D, Applied physics, 2011-03, Vol.44 (8), p.085301</ispartof><rights>2015 INIST-CNRS</rights><rights>Distributed under a Creative Commons Attribution 4.0 International License</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c442t-cf51edd3c7f77bb7c0fab0211e46a8d840a629b749f0fea23e9fadba4c5a1d93</citedby><cites>FETCH-LOGICAL-c442t-cf51edd3c7f77bb7c0fab0211e46a8d840a629b749f0fea23e9fadba4c5a1d93</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://iopscience.iop.org/article/10.1088/0022-3727/44/8/085301/pdf$$EPDF$$P50$$Giop$$H</linktopdf><link.rule.ids>230,314,780,784,885,27924,27925,53830,53910</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=23900526$$DView record in Pascal Francis$$Hfree_for_read</backlink><backlink>$$Uhttps://hal.science/hal-00597846$$DView record in HAL$$Hfree_for_read</backlink></links><search><creatorcontrib>Beake, B D</creatorcontrib><creatorcontrib>Vishnyakov, V M</creatorcontrib><creatorcontrib>Colligon, J S</creatorcontrib><title>Nano-impact testing of TiFeN and TiFeMoN films for dynamic toughness evaluation</title><title>Journal of physics. D, Applied physics</title><description>TiFeN and TiFeMoN films were deposited on silicon wafers by ion-beam-assisted deposition. Their mechanical properties were measured by nanoindentation (quasi-static) and nano-impact (dynamic) techniques. Nano-impact testing enabled assessment of their toughness and resistance to fatigue fracture under repetitive loading. At low impact forces, films with a higher resistance to plastic deformation (
H
3
/
E
2
) were much more resistant to the formation of cracks throughout the test. At higher impact forces, these films initially show impact resistance but with continued impacts they are unable to protect the Si substrate, performing as poorly as films with lower
H
3
/
E
2
and suffer delamination from the Si substrate over a large area.</description><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Exact sciences and technology</subject><subject>Mechanical and acoustical properties</subject><subject>Physical properties of thin films, nonelectronic</subject><subject>Physics</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><issn>0022-3727</issn><issn>1361-6463</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2011</creationdate><recordtype>article</recordtype><recordid>eNqNkD1PwzAQhi0EEqXwE5C8MCAR6q_EyVhVlCKVduluXRy7NUrjKE4r9d-TNKgLDEx3Zz3Pnfwi9EjJKyVpOiGEsYhLJidCTLoxjTmhV2hEeUKjRCT8Go0uzC26C-GLEBInKR2h9QoqH7l9DbrFrQmtq7bYW7xxc7PCUBXn7tOvsHXlPmDrG1ycKtg7jVt_2O4qEwI2RygP0Dpf3aMbC2UwDz91jDbzt81sES3X7x-z6TLSQrA20jampii4llbKPJeaWMgJo9SIBNIiFQQSluVSZJZYA4ybzEKRg9Ax0CLjY_Q8rN1BqerG7aE5KQ9OLaZL1b91_8tkKpIj7dh4YHXjQ2iMvQiUqD5A1Yej-nCUEKobzwF23tPg1RA0lLaBSrtwkRnPuiMs6TgycM7X_1798lv5E1V1Yfk3D2aMHA</recordid><startdate>20110302</startdate><enddate>20110302</enddate><creator>Beake, B D</creator><creator>Vishnyakov, V M</creator><creator>Colligon, J S</creator><general>IOP Publishing</general><general>Institute of Physics</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>1XC</scope><scope>VOOES</scope></search><sort><creationdate>20110302</creationdate><title>Nano-impact testing of TiFeN and TiFeMoN films for dynamic toughness evaluation</title><author>Beake, B D ; Vishnyakov, V M ; Colligon, J S</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c442t-cf51edd3c7f77bb7c0fab0211e46a8d840a629b749f0fea23e9fadba4c5a1d93</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2011</creationdate><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Exact sciences and technology</topic><topic>Mechanical and acoustical properties</topic><topic>Physical properties of thin films, nonelectronic</topic><topic>Physics</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Beake, B D</creatorcontrib><creatorcontrib>Vishnyakov, V M</creatorcontrib><creatorcontrib>Colligon, J S</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Hyper Article en Ligne (HAL)</collection><collection>Hyper Article en Ligne (HAL) (Open Access)</collection><jtitle>Journal of physics. D, Applied physics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Beake, B D</au><au>Vishnyakov, V M</au><au>Colligon, J S</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Nano-impact testing of TiFeN and TiFeMoN films for dynamic toughness evaluation</atitle><jtitle>Journal of physics. D, Applied physics</jtitle><date>2011-03-02</date><risdate>2011</risdate><volume>44</volume><issue>8</issue><spage>085301</spage><pages>085301-</pages><issn>0022-3727</issn><eissn>1361-6463</eissn><coden>JPAPBE</coden><abstract>TiFeN and TiFeMoN films were deposited on silicon wafers by ion-beam-assisted deposition. Their mechanical properties were measured by nanoindentation (quasi-static) and nano-impact (dynamic) techniques. Nano-impact testing enabled assessment of their toughness and resistance to fatigue fracture under repetitive loading. At low impact forces, films with a higher resistance to plastic deformation (
H
3
/
E
2
) were much more resistant to the formation of cracks throughout the test. At higher impact forces, these films initially show impact resistance but with continued impacts they are unable to protect the Si substrate, performing as poorly as films with lower
H
3
/
E
2
and suffer delamination from the Si substrate over a large area.</abstract><cop>Bristol</cop><pub>IOP Publishing</pub><doi>10.1088/0022-3727/44/8/085301</doi><oa>free_for_read</oa></addata></record> |
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| ispartof | Journal of physics. D, Applied physics, 2011-03, Vol.44 (8), p.085301 |
| issn | 0022-3727 1361-6463 |
| language | eng |
| recordid | cdi_pascalfrancis_primary_23900526 |
| source | Institute of Physics Journals |
| subjects | Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Mechanical and acoustical properties Physical properties of thin films, nonelectronic Physics Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) |
| title | Nano-impact testing of TiFeN and TiFeMoN films for dynamic toughness evaluation |
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