Temperature cycling analysis for ball grid array package using finite element analysis

Purpose - The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array (BGA) package.Design methodology approach - Thermal cycling test has been use...

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Veröffentlicht in:	Microelectronics international 2011-01, Vol.28 (1), p.17-28
Hauptverfasser:	Nubli Zulkifli, Muhammad, Azhar Zahid Jamal, Zul, Abdul Quadir, Ghulam
Format:	Artikel
Sprache:	eng
Schlagworte:	Analysis Applied sciences Charge transfer devices Crack initiation Design engineering Design factors Design. Technologies. Operation analysis. Testing Dwell time Electronics Exact sciences and technology Fatigue life Finite element analysis Finite element method Imaging devices Integrated circuits Joining Optimization techniques Packages Product development Ramps Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Soldering Solders Stress Studies Symmetry Thermal cycling
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