Electrical properties of sub-100 nm Cu films deposited by electroless plating on amino-terminated silicon oxide activated with Au nano-particles

Self-assembled organic monolayers (SAMs) are good coupling agents and diffusion barriers at Cu/SiO 2 and Cu/low-k interfaces and are considered therefore as important elements of future all-wet ULSI metallization with sub-45 nm Cu deposited by electroless plating (ELD). We formed SAM of 3-aminopropy...

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