Effect of a Ti interlayer on the bond strength and thermal stability of the Cu/benzocyclobutene-divinyl tetramethyldisiloxane interface

A series of experiments were carried out to investigate the adhesion properties and thermal stability of Cu/benzocyclobutene-divinyl tetramethyldisiloxane (BCB-DVS) interfaces by a stud pull test and cross-sectional transmission electron microscopy (TEM), respectively. Multilayered specimens were pr...

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Veröffentlicht in:	Journal of adhesion science and technology 1998-01, Vol.12 (1), p.19-28
Hauptverfasser:	Shieu, F.S., Shiao, M.H.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences BCB-DVS bond strength cross-sectional TEM Exact sciences and technology Physical properties Polymer industry, paints, wood Properties and testing Surface properties Technology of polymers thermal stability
Online-Zugang:	Volltext
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