Characterization of Parylene-N as Flexible Substrate and Passivation Layer for Microwave and Millimeter-Wave Integrated Circuits

Investigation of Parylene-N (Pa-N) as a flexible substrate, multilayer dielectric material, and passivation layer for microwave and millimeter-wave integrated circuits is presented. For the first time, the electrical properties of Parylene-N have been characterized up to 60 GHz using various microst...

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Veröffentlicht in:IEEE transactions on advanced packaging 2009-02, Vol.32 (1), p.84-92
Hauptverfasser: Sharifi, H., Lahiji, R.R., Han-Chung Lin, Ye, P.D., Katehi, L.P.B., Mohammadi, S.
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Sprache:eng
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