Microstructural changes of lead-free solder joints during long-term ageing, thermal cycling and vibration fatigue

Purpose - The purpose of this paper is to investigate the microstructural development of SnAgCu solder joints under different loading conditions (isothermal storage, thermal cycling and vibration).Design methodology approach - The observed microstructural changes have been studied with respect to gr...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Soldering & surface mount technology 2008-01, Vol.20 (1), p.13-21
Hauptverfasser:	Fix, Andreas R, Nüchter, Wolfgang, Wilde, Jürgen
Format:	Artikel
Sprache:	eng
Schlagworte:	Aging Applied sciences Copper Crack initiation Crack propagation Design. Technologies. Operation analysis. Testing Diffusion Electronics Etching Exact sciences and technology Heat treating Integrated circuits Intermetallic compounds Investigations Ion beams Microscopy Microstructure Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Soldering Studies Thermal cycling Tin Vibration
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!