Damascene copper electroplating for chip interconnections

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Hauptverfasser:	ANDRICACOS, P. C, UZOH, C, DUKOVIC, J. O, HORKANS, J, DELIGIANNI, H
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Applied sciences Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Integrated circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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creator	ANDRICACOS, P. C UZOH, C DUKOVIC, J. O HORKANS, J DELIGIANNI, H
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ispartof	Proceedings - Electrochemical Society, 1998, p.48-58
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subjects	Applied sciences Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Integrated circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
title	Damascene copper electroplating for chip interconnections
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