Simple design formula for parallel plate mode suppression by ground via-holes

In a multi-layered RF circuit, it is important to avoid unexpected coupling caused by a parallel plate mode excited between different ground layers. Ground via-holes that short-circuit different ground layers are used for suppressing this mode. Quantitative evaluation of relations between suppressio...

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Hauptverfasser: Yuasa, T., Nishino, T., Oh-Hashi, H.
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description In a multi-layered RF circuit, it is important to avoid unexpected coupling caused by a parallel plate mode excited between different ground layers. Ground via-holes that short-circuit different ground layers are used for suppressing this mode. Quantitative evaluation of relations between suppression effect and ground via-hole disposition is required for optimal design. In this paper, a simple design formula that describes the suppression ratio is derived by mode-matching technique. The results of comparison with an FEM simulation validate our proposing formula. It is shown that the technique is indispensable for designing optimal disposition of via-holes to minimize the area of the ground via-holes for desired performance.
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fullrecord <record><control><sourceid>pascalfrancis_6IE</sourceid><recordid>TN_cdi_pascalfrancis_primary_17457309</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1336067</ieee_id><sourcerecordid>17457309</sourcerecordid><originalsourceid>FETCH-LOGICAL-i118t-6f2872918ef48b8a8ac2556ef0d9a6daab520212f5003fa0a966576dcbb52c993</originalsourceid><addsrcrecordid>eNpFkE1LAzEYhIMfYK39A3rJxePW90022exRil_Q4qGKeirv7iY1kt0NGyv039tSwbnMYR4GZhi7RJgiQnmzeFt-LKYCIJ-ilBp0ccRGQhU6KwTqY3YOhQFppEQ8YSPAvMx0rt7P2CSlL9gpVzmiGrHF0rcxWN7Y5Ncdd_3QbgLtnUcaKAQbeAz0bXnbN5anTYyDTcn3Ha-2fD30m67hP56yzz7YdMFOHYVkJ38-Zq_3dy-zx2z-_PA0u51nHtF8Z9oJU4gSjXW5qQwZqoVS2jpoStINUaUECBROAUhHQKXWu21NXe2CuizlmF0feiOlmoIbqKt9WsXBtzRsV1jkqpCw564OnLfW_seHx-QvFARdsQ</addsrcrecordid><sourcetype>Index Database</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Simple design formula for parallel plate mode suppression by ground via-holes</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Yuasa, T. ; Nishino, T. ; Oh-Hashi, H.</creator><creatorcontrib>Yuasa, T. ; Nishino, T. ; Oh-Hashi, H.</creatorcontrib><description>In a multi-layered RF circuit, it is important to avoid unexpected coupling caused by a parallel plate mode excited between different ground layers. Ground via-holes that short-circuit different ground layers are used for suppressing this mode. Quantitative evaluation of relations between suppression effect and ground via-hole disposition is required for optimal design. In this paper, a simple design formula that describes the suppression ratio is derived by mode-matching technique. The results of comparison with an FEM simulation validate our proposing formula. It is shown that the technique is indispensable for designing optimal disposition of via-holes to minimize the area of the ground via-holes for desired performance.</description><identifier>ISSN: 0149-645X</identifier><identifier>ISBN: 0780383311</identifier><identifier>ISBN: 9780780383319</identifier><identifier>EISSN: 2576-7216</identifier><identifier>DOI: 10.1109/MWSYM.2004.1336067</identifier><language>eng</language><publisher>Piscataway NJ: IEEE</publisher><subject>Applied sciences ; Circuit optimization ; Computational modeling ; Coupling circuits ; Degradation ; Design. Technologies. Operation analysis. Testing ; Dielectric substrates ; Electronics ; Equivalent circuits ; Exact sciences and technology ; Integrated circuits ; Millimeter wave circuits ; Millimeter wave technology ; Packaging ; Radio frequency ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><ispartof>2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535), 2004, Vol.2, p.641-644 Vol.2</ispartof><rights>2006 INIST-CNRS</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1336067$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,4050,4051,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1336067$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&amp;idt=17457309$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Yuasa, T.</creatorcontrib><creatorcontrib>Nishino, T.</creatorcontrib><creatorcontrib>Oh-Hashi, H.</creatorcontrib><title>Simple design formula for parallel plate mode suppression by ground via-holes</title><title>2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535)</title><addtitle>MWSYM</addtitle><description>In a multi-layered RF circuit, it is important to avoid unexpected coupling caused by a parallel plate mode excited between different ground layers. Ground via-holes that short-circuit different ground layers are used for suppressing this mode. Quantitative evaluation of relations between suppression effect and ground via-hole disposition is required for optimal design. In this paper, a simple design formula that describes the suppression ratio is derived by mode-matching technique. The results of comparison with an FEM simulation validate our proposing formula. It is shown that the technique is indispensable for designing optimal disposition of via-holes to minimize the area of the ground via-holes for desired performance.</description><subject>Applied sciences</subject><subject>Circuit optimization</subject><subject>Computational modeling</subject><subject>Coupling circuits</subject><subject>Degradation</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Dielectric substrates</subject><subject>Electronics</subject><subject>Equivalent circuits</subject><subject>Exact sciences and technology</subject><subject>Integrated circuits</subject><subject>Millimeter wave circuits</subject><subject>Millimeter wave technology</subject><subject>Packaging</subject><subject>Radio frequency</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><issn>0149-645X</issn><issn>2576-7216</issn><isbn>0780383311</isbn><isbn>9780780383319</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2004</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpFkE1LAzEYhIMfYK39A3rJxePW90022exRil_Q4qGKeirv7iY1kt0NGyv039tSwbnMYR4GZhi7RJgiQnmzeFt-LKYCIJ-ilBp0ccRGQhU6KwTqY3YOhQFppEQ8YSPAvMx0rt7P2CSlL9gpVzmiGrHF0rcxWN7Y5Ncdd_3QbgLtnUcaKAQbeAz0bXnbN5anTYyDTcn3Ha-2fD30m67hP56yzz7YdMFOHYVkJ38-Zq_3dy-zx2z-_PA0u51nHtF8Z9oJU4gSjXW5qQwZqoVS2jpoStINUaUECBROAUhHQKXWu21NXe2CuizlmF0feiOlmoIbqKt9WsXBtzRsV1jkqpCw564OnLfW_seHx-QvFARdsQ</recordid><startdate>2004</startdate><enddate>2004</enddate><creator>Yuasa, T.</creator><creator>Nishino, T.</creator><creator>Oh-Hashi, H.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope><scope>IQODW</scope></search><sort><creationdate>2004</creationdate><title>Simple design formula for parallel plate mode suppression by ground via-holes</title><author>Yuasa, T. ; Nishino, T. ; Oh-Hashi, H.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i118t-6f2872918ef48b8a8ac2556ef0d9a6daab520212f5003fa0a966576dcbb52c993</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Applied sciences</topic><topic>Circuit optimization</topic><topic>Computational modeling</topic><topic>Coupling circuits</topic><topic>Degradation</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Dielectric substrates</topic><topic>Electronics</topic><topic>Equivalent circuits</topic><topic>Exact sciences and technology</topic><topic>Integrated circuits</topic><topic>Millimeter wave circuits</topic><topic>Millimeter wave technology</topic><topic>Packaging</topic><topic>Radio frequency</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><toplevel>online_resources</toplevel><creatorcontrib>Yuasa, T.</creatorcontrib><creatorcontrib>Nishino, T.</creatorcontrib><creatorcontrib>Oh-Hashi, H.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection><collection>Pascal-Francis</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yuasa, T.</au><au>Nishino, T.</au><au>Oh-Hashi, H.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Simple design formula for parallel plate mode suppression by ground via-holes</atitle><btitle>2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535)</btitle><stitle>MWSYM</stitle><date>2004</date><risdate>2004</risdate><volume>2</volume><spage>641</spage><epage>644 Vol.2</epage><pages>641-644 Vol.2</pages><issn>0149-645X</issn><eissn>2576-7216</eissn><isbn>0780383311</isbn><isbn>9780780383319</isbn><abstract>In a multi-layered RF circuit, it is important to avoid unexpected coupling caused by a parallel plate mode excited between different ground layers. Ground via-holes that short-circuit different ground layers are used for suppressing this mode. Quantitative evaluation of relations between suppression effect and ground via-hole disposition is required for optimal design. In this paper, a simple design formula that describes the suppression ratio is derived by mode-matching technique. The results of comparison with an FEM simulation validate our proposing formula. It is shown that the technique is indispensable for designing optimal disposition of via-holes to minimize the area of the ground via-holes for desired performance.</abstract><cop>Piscataway NJ</cop><pub>IEEE</pub><doi>10.1109/MWSYM.2004.1336067</doi></addata></record>
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subjects Applied sciences
Circuit optimization
Computational modeling
Coupling circuits
Degradation
Design. Technologies. Operation analysis. Testing
Dielectric substrates
Electronics
Equivalent circuits
Exact sciences and technology
Integrated circuits
Millimeter wave circuits
Millimeter wave technology
Packaging
Radio frequency
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
title Simple design formula for parallel plate mode suppression by ground via-holes
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-24T23%3A11%3A22IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-pascalfrancis_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Simple%20design%20formula%20for%20parallel%20plate%20mode%20suppression%20by%20ground%20via-holes&rft.btitle=2004%20IEEE%20MTT-S%20International%20Microwave%20Symposium%20Digest%20(IEEE%20Cat.%20No.04CH37535)&rft.au=Yuasa,%20T.&rft.date=2004&rft.volume=2&rft.spage=641&rft.epage=644%20Vol.2&rft.pages=641-644%20Vol.2&rft.issn=0149-645X&rft.eissn=2576-7216&rft.isbn=0780383311&rft.isbn_list=9780780383319&rft_id=info:doi/10.1109/MWSYM.2004.1336067&rft_dat=%3Cpascalfrancis_6IE%3E17457309%3C/pascalfrancis_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=1336067&rfr_iscdi=true