Coupling between microstrip lines with finite width ground plane embedded in thin-film circuits

Three-dimensional (3-D) interconnects built upon multiple layers of polyimide are required for constructing 3-D circuits on CMOS (low resistivity) Si wafers, GaAs, and ceramic substrates. Thin-film microstrip lines (TFMS) with finite-width ground planes embedded in the polyimide are often used. Howe...

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Veröffentlicht in:	IEEE transactions on advanced packaging 2005-05, Vol.28 (2), p.320-327
Hauptverfasser:	Ponchak, G.E., Dalton, E., Tentzeris, M.M., Papapolymerou, J.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Ceramics Circuits Conductivity Coupling Coupling circuits crosstalk Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Finite difference methods finite-difference time domain (FDTD) Gallium arsenide Ground plane Integrated circuit interconnections Integrated circuits Joining Mathematical analysis Microstrip Microstrip lines Polyimide resins Polyimides Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Silicon substrates Thin film circuits Thin films Time domain analysis
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