Low-cost test of embedded RF/analog/mixed-signal circuits in SOPs: System-On-Package (SOP)

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Bibliographische Detailangaben
Veröffentlicht in:	IEEE transactions on advanced packaging 2004, Vol.27 (2), p.352-363
Hauptverfasser:	AKBAY, Selim Sermet, HALDER, Achintya, CHATTERJEE, Abhijit, KEEZER, David
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Circuit properties Design. Technologies. Operation analysis. Testing Electric, optical and optoelectronic circuits Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Integrated circuits Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Testing, measurement, noise and reliability
Online-Zugang:	Volltext
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