Adaptive modeling and design of highly integrated 3D microwave-millimeter wave radio front-ends
The FDTD and the Haar-based MRTD algorithms are applied to the full-wave modeling of highly integrated 3D microwave and millimeter wave radio front-ends that require the optimization of various components as well as the minimization of the crosstalk between them. The numerical results have demonstra...
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description | The FDTD and the Haar-based MRTD algorithms are applied to the full-wave modeling of highly integrated 3D microwave and millimeter wave radio front-ends that require the optimization of various components as well as the minimization of the crosstalk between them. The numerical results have demonstrated a very good computational efficiency in the calculation of the scattering parameters, the Q-factor, as well as in the estimation of the radiation pattern, of the packaging effects and of the parasitic crosstalk between neighboring geometries. |
doi_str_mv | 10.1109/GAAS.2002.1049040 |
format | Conference Proceeding |
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The numerical results have demonstrated a very good computational efficiency in the calculation of the scattering parameters, the Q-factor, as well as in the estimation of the radiation pattern, of the packaging effects and of the parasitic crosstalk between neighboring geometries.</description><subject>Applied sciences</subject><subject>Biomembranes</subject><subject>Crosstalk</subject><subject>Design optimization</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Finite difference methods</subject><subject>Inductors</subject><subject>Integrated circuits</subject><subject>Millimeter wave technology</subject><subject>Packaging</subject><subject>Q factor</subject><subject>Scattering parameters</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Time domain analysis</subject><issn>1064-7775</issn><issn>2379-5638</issn><isbn>9780780374478</isbn><isbn>0780374479</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2002</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpFUMtqwzAQFH1AQ5oPKL3o0qPS1cuSjyZt0kKgh7bnIEtrR8WPIJuU_H1dUuiyMLMzwxyWkDsOS84hf9wUxftSAIglB5WDggsyE9LkTGfSXpJFbixMK41Sxl6RGYdMMWOMviGLYfiCaZRWoLIZ2RXBHcZ4RNr2AZvY1dR1gQYcYt3RvqL7WO-bE43diHVyIwYqn2gbfeq_3RFZG5smtjhior83TS7Enlap70aGXRhuyXXlmgEXfzgnn-vnj9UL275tXlfFlkUu9ciMFk5o4J57Aahyb4PNvUfBHVdW60nIeFmKDCFYXoFystTalKgFqonJOXk49x7c4F1TJdf5OOwOKbYunXZcZzyHTEy5-3MuIuK_fX6j_AGermOk</recordid><startdate>2002</startdate><enddate>2002</enddate><creator>Tentzeris, E.M.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope><scope>IQODW</scope></search><sort><creationdate>2002</creationdate><title>Adaptive modeling and design of highly integrated 3D microwave-millimeter wave radio front-ends</title><author>Tentzeris, E.M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i135t-752a2501c1c20e49c8d89cce21a148559c861bb26e0d81f04a3b557be52e4b553</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2002</creationdate><topic>Applied sciences</topic><topic>Biomembranes</topic><topic>Crosstalk</topic><topic>Design optimization</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Finite difference methods</topic><topic>Inductors</topic><topic>Integrated circuits</topic><topic>Millimeter wave technology</topic><topic>Packaging</topic><topic>Q factor</topic><topic>Scattering parameters</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Time domain analysis</topic><toplevel>online_resources</toplevel><creatorcontrib>Tentzeris, E.M.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection><collection>Pascal-Francis</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Tentzeris, E.M.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Adaptive modeling and design of highly integrated 3D microwave-millimeter wave radio front-ends</atitle><btitle>24th Annual Technical Digest Gallium Arsenide Integrated Circuit (GaAs IC) Symposiu</btitle><stitle>GAAS</stitle><date>2002</date><risdate>2002</risdate><spage>109</spage><epage>112</epage><pages>109-112</pages><issn>1064-7775</issn><eissn>2379-5638</eissn><isbn>9780780374478</isbn><isbn>0780374479</isbn><abstract>The FDTD and the Haar-based MRTD algorithms are applied to the full-wave modeling of highly integrated 3D microwave and millimeter wave radio front-ends that require the optimization of various components as well as the minimization of the crosstalk between them. The numerical results have demonstrated a very good computational efficiency in the calculation of the scattering parameters, the Q-factor, as well as in the estimation of the radiation pattern, of the packaging effects and of the parasitic crosstalk between neighboring geometries.</abstract><cop>Piscataway NJ</cop><pub>IEEE</pub><doi>10.1109/GAAS.2002.1049040</doi><tpages>4</tpages></addata></record> |
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identifier | ISSN: 1064-7775 |
ispartof | 24th Annual Technical Digest Gallium Arsenide Integrated Circuit (GaAs IC) Symposiu, 2002, p.109-112 |
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language | eng |
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source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Applied sciences Biomembranes Crosstalk Design optimization Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Finite difference methods Inductors Integrated circuits Millimeter wave technology Packaging Q factor Scattering parameters Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Time domain analysis |
title | Adaptive modeling and design of highly integrated 3D microwave-millimeter wave radio front-ends |
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