Die attach delamination characterization modeling for SOIC package

Die attach delamination is a critical reliability problem which may cause thermal management and electrical issues, and can further increase the risk of contamination-related failure and stitch bond failures. In this paper, die attach delamination of a SOIC package is simulated and analyzed by 2D/3D...

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Hauptverfasser:	Yong Liu, Irving, S., Rioux, M., Schoenberg, A.J., Chong, D.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Analytical models Applied sciences Bonding Delamination Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Integrated circuits Microassembly Moisture Packaging Risk management Semiconductor device modeling Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Testing, measurement, noise and reliability Thermal management Thermal stresses
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