Results of comparative reliability tests on lead-free solder alloys

The use of lead-free solder brings up concerns regarding the reliability of the new alloys to be used. In a European project (LEADFREE) SnAg, SnAgCu, SnAgCuSb, SnZn and SnPbAg have been tested in order to evaluate comparative data of the growth of cracks in solder joints. Reliability tests performed...

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Hauptverfasser:	Grossmann, G., Nicoletti, G., Soler, U.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Applied sciences Capacitive sensors Creep Deformable models Design. Technologies. Operation analysis. Testing Electronics Environmentally friendly manufacturing techniques Exact sciences and technology Integrated circuits Lead Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Soldering Temperature Testing Testing, measurement, noise and reliability Thermal degradation Thermal stresses
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