Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation: Fracture nanomechanics

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Veröffentlicht in:	International journal of fracture 2003, Vol.119-20 (4/1-2), p.421-429
Hauptverfasser:	SCHERBAN, T, PANTUSO, D, SUN, B, EL-MANSY, S, XU, J, ELIZALDE, M. R, SANCHEZ, J. M, MARTINEZ-ESNAOLA, J. M
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Sprache:	eng
Schlagworte:	Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Fatigue, brittleness, fracture, and cracks Mechanical and acoustical properties Mechanical and acoustical properties of condensed matter Mechanical properties of solids Physical properties of thin films, nonelectronic Physics Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties)
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source	SpringerLink Journals - AutoHoldings
subjects	Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Fatigue, brittleness, fracture, and cracks Mechanical and acoustical properties Mechanical and acoustical properties of condensed matter Mechanical properties of solids Physical properties of thin films, nonelectronic Physics Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties)
title	Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation: Fracture nanomechanics
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