Laser-assisted sealing and testing for ceramic packaging of MEMS devices
In this work, a CO/sub 2/ laser-assisted silicon lid sealing process, utilizing Au80/Sn20 solder, for encapsulating gas breakdown test micro-electro-mechanical structures (MEMS) in a ceramic quad flatpack (CQFP) was studied. Wire bonded MEMS dies were sealed into CQFPs under various gas media, such...
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| Veröffentlicht in: | IEEE transactions on advanced packaging 2003-08, Vol.26 (3), p.283-288 |
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| container_end_page | 288 |
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| container_issue | 3 |
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| container_title | IEEE transactions on advanced packaging |
| container_volume | 26 |
| creator | Yi Tao Malshe, A.P. Brown, W.D. DeReus, D.R. Cunningham, S. |
| description | In this work, a CO/sub 2/ laser-assisted silicon lid sealing process, utilizing Au80/Sn20 solder, for encapsulating gas breakdown test micro-electro-mechanical structures (MEMS) in a ceramic quad flatpack (CQFP) was studied. Wire bonded MEMS dies were sealed into CQFPs under various gas media, such as air, nitrogen, helium and vacuum. The gas breakdown test results showed a significantly higher breakdown voltage for vacuum packaged parts compared to those packaged in other various gas environments. Hermeticity testing according to MIL-STD-883E showed that the leak rate of the package was below 10/sup -8/ atm cc/s. The bonding was uniform and the bonding strength is believed to be comparable to the tensile strength of Au80/Sn20 solder. |
| doi_str_mv | 10.1109/TADVP.2003.817969 |
| format | Article |
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Wire bonded MEMS dies were sealed into CQFPs under various gas media, such as air, nitrogen, helium and vacuum. The gas breakdown test results showed a significantly higher breakdown voltage for vacuum packaged parts compared to those packaged in other various gas environments. Hermeticity testing according to MIL-STD-883E showed that the leak rate of the package was below 10/sup -8/ atm cc/s. The bonding was uniform and the bonding strength is believed to be comparable to the tensile strength of Au80/Sn20 solder.</description><identifier>ISSN: 1521-3323</identifier><identifier>EISSN: 1557-9980</identifier><identifier>DOI: 10.1109/TADVP.2003.817969</identifier><identifier>CODEN: ITAPFZ</identifier><language>eng</language><publisher>Piscataway, NY: IEEE</publisher><subject>Applied sciences ; Bonding ; Ceramics ; Design. Technologies. Operation analysis. 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Testing</subject><subject>Electric breakdown</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Gas lasers</subject><subject>Integrated circuits</subject><subject>Micro- and nanoelectromechanical devices (mems/nems)</subject><subject>Microelectromechanical devices</subject><subject>Micromechanical devices</subject><subject>Packaging</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. 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Solid state devices</topic><topic>Silicon</topic><topic>Testing</topic><topic>Vacuum breakdown</topic><toplevel>online_resources</toplevel><creatorcontrib>Yi Tao</creatorcontrib><creatorcontrib>Malshe, A.P.</creatorcontrib><creatorcontrib>Brown, W.D.</creatorcontrib><creatorcontrib>DeReus, D.R.</creatorcontrib><creatorcontrib>Cunningham, S.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Ceramic Abstracts</collection><collection>METADEX</collection><collection>Materials Research Database</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Engineering Research Database</collection><jtitle>IEEE transactions on advanced packaging</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yi Tao</au><au>Malshe, A.P.</au><au>Brown, W.D.</au><au>DeReus, D.R.</au><au>Cunningham, S.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Laser-assisted sealing and testing for ceramic packaging of MEMS devices</atitle><jtitle>IEEE transactions on advanced packaging</jtitle><stitle>TADVP</stitle><date>2003-08-01</date><risdate>2003</risdate><volume>26</volume><issue>3</issue><spage>283</spage><epage>288</epage><pages>283-288</pages><issn>1521-3323</issn><eissn>1557-9980</eissn><coden>ITAPFZ</coden><abstract>In this work, a CO/sub 2/ laser-assisted silicon lid sealing process, utilizing Au80/Sn20 solder, for encapsulating gas breakdown test micro-electro-mechanical structures (MEMS) in a ceramic quad flatpack (CQFP) was studied. 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| ispartof | IEEE transactions on advanced packaging, 2003-08, Vol.26 (3), p.283-288 |
| issn | 1521-3323 1557-9980 |
| language | eng |
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| source | IEEE Electronic Library (IEL) |
| subjects | Applied sciences Bonding Ceramics Design. Technologies. Operation analysis. Testing Electric breakdown Electronics Exact sciences and technology Gas lasers Integrated circuits Micro- and nanoelectromechanical devices (mems/nems) Microelectromechanical devices Micromechanical devices Packaging Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Silicon Testing Vacuum breakdown |
| title | Laser-assisted sealing and testing for ceramic packaging of MEMS devices |
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