Characterization of lead-free solders and under bump metallurgies for flip-chip package

A variety of Pb-free solders and under bump metallurgies (UBMs) was investigated for flip chip packaging applications. The result shows that the Sn-0.7Cu eutectic alloy has the best fatigue life and it possess the most desirable failure mechanism in both thermal and isothermal mechanical tests regar...

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Veröffentlicht in:	IEEE transactions on electronics packaging manufacturing 2002-10, Vol.25 (4), p.300-307
Hauptverfasser:	Jong-Kai Lin, De Silva, A., Frear, D., Guo, Y., Hayes, S., Jin-Wook Jang, Li, L., Mitchell, D., Yeung, B., Zhang, C.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Chips Consumption Copper Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Environmentally friendly manufacturing techniques Exact sciences and technology Failure analysis Fatigue Flip chip Isothermal processes Lead Lead base alloys Life testing Microelectronic fabrication (materials and surfaces technology) Packaging Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Solders Solid state circuits Temperature Testing, measurement, noise and reliability Thermal cycling Tin Tin base alloys
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