Wetting characteristics of Pb-free solder alloys and PWB finishes

For a successful transition to Pb-free manufacturing in electronics assembly, it is critical to understand the behavior of Pb-free solders (in bulk and paste form) and their interaction with the Pb-free printed wiring board (PWB) finishes. This paper presents the results obtained from solder paste s...

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Veröffentlicht in:	IEEE transactions on electronics packaging manufacturing 2002-07, Vol.25 (3), p.168-184
Hauptverfasser:	Sattiraju, S.V., Bing Dang, Johnson, R.W., Yali Li, Smith, J.S., Bozack, M.J.
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Applied sciences Assembly Circuit boards Design. Technologies. Operation analysis. Testing Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Finishes Integrated circuits Lead base alloys Manufacturing Microelectronic fabrication (materials and surfaces technology) Nitrogen Performance evaluation Printed circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Sequential analysis Solders Spectroscopy Spectrum analysis Spreads Studies Surface finishing Testing Tin Wetting Wiring
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