Application of defected ground structure in reducing the size of amplifiers

This letter presents a new technique to reduce the size of microwave amplifiers using a defected ground structure (DGS). The DGS on the ground plane of a microstrip line provides an additional effective inductive component, which enables a microstrip line with very high impedance to be realized and...

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Veröffentlicht in:	IEEE microwave and wireless components letters 2002-07, Vol.12 (7), p.261-263
Hauptverfasser:	LIM, Jong-Sik, PARK, Jun-Seok, LEE, Young-Taek, AHN, Dal, NAM, Sangwook
Format:	Artikel
Sprache:	eng
Schlagworte:	Amplifiers Applied sciences Associate members Circuit properties Dielectric substrates Distributed amplifiers Electric, optical and optoelectronic circuits Electronics Exact sciences and technology Ground plane Grounds High impedance Impedance matching Matching Microstrip components Microstrip lines Microwave amplifiers Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits Microwave theory and techniques Microwaves Performance evaluation Periodic structures Power transmission lines Resultants
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