Analysis on solder ball shear testing conditions with a simple computational model

This paper introduces a simple computational model for the analysis on the solder ball shear testing conditions. Both two-dimensional (2-D) and three-dimensional (3-D) finite element models are used to investigate the effect of shear ram speed on the solder ball shear strength of plastic ball grid a...

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Veröffentlicht in:	Soldering & surface mount technology 2002-01, Vol.14 (1), p.45-48
Hauptverfasser:	Ricky Lee, S.W, Huang, Xingjia
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Arrays Dimensional analysis Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Experiments Finite element analysis Manufacturing Shear strength Shear tests Soldering Surface mount technology Testing Testing, measurement, noise and reliability
Online-Zugang:	Volltext
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