Fabrication, structure and mechanical properties of indium nanopillars
Solid and hollow cylindrical indium pillars with nanoscale diameters were prepared using electron beam lithography followed by the electroplating fabrication method. The microstructure of the solid-core indium pillars was characterized by scanning micro-X-ray diffraction, which shows that the indium...
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| Veröffentlicht in: | Acta materialia 2010-02, Vol.58 (4), p.1361-1368 |
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| container_title | Acta materialia |
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| creator | Lee, Gyuhyon Kim, Ju-Young Budiman, Arief Suriadi Tamura, Nobumichi Kunz, Martin Chen, Kai Burek, Michael J. Greer, Julia R. Tsui, Ting Y. |
| description | Solid and hollow cylindrical indium pillars with nanoscale diameters were prepared using electron beam lithography followed by the electroplating fabrication method. The microstructure of the solid-core indium pillars was characterized by scanning micro-X-ray diffraction, which shows that the indium pillars were annealed at room temperature with very few dislocations remaining in the samples. The mechanical properties of the solid pillars were characterized using a uniaxial microcompression technique, which demonstrated that the engineering yield stress is ∼9 times greater than bulk and is ∼1/28 of the indium shear modulus, suggesting that the attained stresses are close to theoretical strength. Microcompression of hollow indium nanopillars showed evidence of brittle fracture. This may suggest that the failure mode for one of the most ductile metals can become brittle when the feature size is sufficiently small. |
| doi_str_mv | 10.1016/j.actamat.2009.10.042 |
| format | Article |
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(LBNL), Berkeley, CA (United States)</creatorcontrib><description>Solid and hollow cylindrical indium pillars with nanoscale diameters were prepared using electron beam lithography followed by the electroplating fabrication method. The microstructure of the solid-core indium pillars was characterized by scanning micro-X-ray diffraction, which shows that the indium pillars were annealed at room temperature with very few dislocations remaining in the samples. The mechanical properties of the solid pillars were characterized using a uniaxial microcompression technique, which demonstrated that the engineering yield stress is ∼9 times greater than bulk and is ∼1/28 of the indium shear modulus, suggesting that the attained stresses are close to theoretical strength. Microcompression of hollow indium nanopillars showed evidence of brittle fracture. This may suggest that the failure mode for one of the most ductile metals can become brittle when the feature size is sufficiently small.</description><identifier>ISSN: 1359-6454</identifier><identifier>EISSN: 1873-2453</identifier><identifier>DOI: 10.1016/j.actamat.2009.10.042</identifier><language>eng</language><publisher>Kidlington: Elsevier Ltd</publisher><subject>36 ; Applied sciences ; Compression test ; DIFFRACTION ; DISLOCATIONS ; ELECTRON BEAMS ; ELECTROPLATING ; Exact sciences and technology ; FABRICATION ; INDIUM ; MECHANICAL PROPERTIES ; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology ; Metallic coatings ; Metals. Metallurgy ; MICROSTRUCTURE ; Plastic deformation ; Production techniques ; SHEAR ; STRESSES ; Surface treatment ; X-ray diffraction ; Yield phenomena</subject><ispartof>Acta materialia, 2010-02, Vol.58 (4), p.1361-1368</ispartof><rights>2009 Acta Materialia Inc.</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c478t-6545aebcdbd8b1b81d6177a4647a59efe60f5dea9bf9e2797d9841b491dd0bc73</citedby><cites>FETCH-LOGICAL-c478t-6545aebcdbd8b1b81d6177a4647a59efe60f5dea9bf9e2797d9841b491dd0bc73</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.actamat.2009.10.042$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>230,314,780,784,885,3548,27922,27923,45993</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=22525002$$DView record in Pascal Francis$$Hfree_for_read</backlink><backlink>$$Uhttps://www.osti.gov/servlets/purl/984735$$D View this record in Osti.gov$$Hfree_for_read</backlink></links><search><creatorcontrib>Lee, Gyuhyon</creatorcontrib><creatorcontrib>Kim, Ju-Young</creatorcontrib><creatorcontrib>Budiman, Arief Suriadi</creatorcontrib><creatorcontrib>Tamura, Nobumichi</creatorcontrib><creatorcontrib>Kunz, Martin</creatorcontrib><creatorcontrib>Chen, Kai</creatorcontrib><creatorcontrib>Burek, Michael J.</creatorcontrib><creatorcontrib>Greer, Julia R.</creatorcontrib><creatorcontrib>Tsui, Ting Y.</creatorcontrib><creatorcontrib>Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)</creatorcontrib><title>Fabrication, structure and mechanical properties of indium nanopillars</title><title>Acta materialia</title><description>Solid and hollow cylindrical indium pillars with nanoscale diameters were prepared using electron beam lithography followed by the electroplating fabrication method. The microstructure of the solid-core indium pillars was characterized by scanning micro-X-ray diffraction, which shows that the indium pillars were annealed at room temperature with very few dislocations remaining in the samples. The mechanical properties of the solid pillars were characterized using a uniaxial microcompression technique, which demonstrated that the engineering yield stress is ∼9 times greater than bulk and is ∼1/28 of the indium shear modulus, suggesting that the attained stresses are close to theoretical strength. Microcompression of hollow indium nanopillars showed evidence of brittle fracture. This may suggest that the failure mode for one of the most ductile metals can become brittle when the feature size is sufficiently small.</description><subject>36</subject><subject>Applied sciences</subject><subject>Compression test</subject><subject>DIFFRACTION</subject><subject>DISLOCATIONS</subject><subject>ELECTRON BEAMS</subject><subject>ELECTROPLATING</subject><subject>Exact sciences and technology</subject><subject>FABRICATION</subject><subject>INDIUM</subject><subject>MECHANICAL PROPERTIES</subject><subject>Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology</subject><subject>Metallic coatings</subject><subject>Metals. Metallurgy</subject><subject>MICROSTRUCTURE</subject><subject>Plastic deformation</subject><subject>Production techniques</subject><subject>SHEAR</subject><subject>STRESSES</subject><subject>Surface treatment</subject><subject>X-ray diffraction</subject><subject>Yield phenomena</subject><issn>1359-6454</issn><issn>1873-2453</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2010</creationdate><recordtype>article</recordtype><recordid>eNqFkEFLxDAQhYsouK7-BKEevNmapEnTnETEVWHBi57LNJlilm5akqzgvzeli1dPEybfm3nzsuyakpISWt_vStAR9hBLRohKvZJwdpKtaCOrgnFRnaZ3JVRRc8HPs4sQdoRQJjlZZZsNdN5qiHZ0d3mI_qDjwWMOzuR71F_g0ueQT36c0EeLIR_73DpjD_vcgRsnOwzgw2V21sMQ8OpY19nn5vnj6bXYvr-8PT1uC81lE4tacAHYadOZpqNdQ01NpQRecwlCYY816YVBUF2vkEkljWo47biixpBOy2qd3SxzxxBtG7SNyaMenUMd28TKSiRGLIz2Ywge-3bydg_-p6WknQNrd-0xsHYObG6nwJLudtFNENLNvQenbfgTMyaYIGTmHhYO06HfFv3sA51GY_1sw4z2n02_dUSE8A</recordid><startdate>20100201</startdate><enddate>20100201</enddate><creator>Lee, Gyuhyon</creator><creator>Kim, Ju-Young</creator><creator>Budiman, Arief Suriadi</creator><creator>Tamura, Nobumichi</creator><creator>Kunz, Martin</creator><creator>Chen, Kai</creator><creator>Burek, Michael J.</creator><creator>Greer, Julia R.</creator><creator>Tsui, Ting Y.</creator><general>Elsevier Ltd</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>OIOZB</scope><scope>OTOTI</scope></search><sort><creationdate>20100201</creationdate><title>Fabrication, structure and mechanical properties of indium nanopillars</title><author>Lee, Gyuhyon ; Kim, Ju-Young ; Budiman, Arief Suriadi ; Tamura, Nobumichi ; Kunz, Martin ; Chen, Kai ; Burek, Michael J. ; Greer, Julia R. ; Tsui, Ting Y.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c478t-6545aebcdbd8b1b81d6177a4647a59efe60f5dea9bf9e2797d9841b491dd0bc73</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2010</creationdate><topic>36</topic><topic>Applied sciences</topic><topic>Compression test</topic><topic>DIFFRACTION</topic><topic>DISLOCATIONS</topic><topic>ELECTRON BEAMS</topic><topic>ELECTROPLATING</topic><topic>Exact sciences and technology</topic><topic>FABRICATION</topic><topic>INDIUM</topic><topic>MECHANICAL PROPERTIES</topic><topic>Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology</topic><topic>Metallic coatings</topic><topic>Metals. Metallurgy</topic><topic>MICROSTRUCTURE</topic><topic>Plastic deformation</topic><topic>Production techniques</topic><topic>SHEAR</topic><topic>STRESSES</topic><topic>Surface treatment</topic><topic>X-ray diffraction</topic><topic>Yield phenomena</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Lee, Gyuhyon</creatorcontrib><creatorcontrib>Kim, Ju-Young</creatorcontrib><creatorcontrib>Budiman, Arief Suriadi</creatorcontrib><creatorcontrib>Tamura, Nobumichi</creatorcontrib><creatorcontrib>Kunz, Martin</creatorcontrib><creatorcontrib>Chen, Kai</creatorcontrib><creatorcontrib>Burek, Michael J.</creatorcontrib><creatorcontrib>Greer, Julia R.</creatorcontrib><creatorcontrib>Tsui, Ting Y.</creatorcontrib><creatorcontrib>Lawrence Berkeley National Lab. 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(LBNL), Berkeley, CA (United States)</aucorp><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Fabrication, structure and mechanical properties of indium nanopillars</atitle><jtitle>Acta materialia</jtitle><date>2010-02-01</date><risdate>2010</risdate><volume>58</volume><issue>4</issue><spage>1361</spage><epage>1368</epage><pages>1361-1368</pages><issn>1359-6454</issn><eissn>1873-2453</eissn><abstract>Solid and hollow cylindrical indium pillars with nanoscale diameters were prepared using electron beam lithography followed by the electroplating fabrication method. The microstructure of the solid-core indium pillars was characterized by scanning micro-X-ray diffraction, which shows that the indium pillars were annealed at room temperature with very few dislocations remaining in the samples. The mechanical properties of the solid pillars were characterized using a uniaxial microcompression technique, which demonstrated that the engineering yield stress is ∼9 times greater than bulk and is ∼1/28 of the indium shear modulus, suggesting that the attained stresses are close to theoretical strength. Microcompression of hollow indium nanopillars showed evidence of brittle fracture. This may suggest that the failure mode for one of the most ductile metals can become brittle when the feature size is sufficiently small.</abstract><cop>Kidlington</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.actamat.2009.10.042</doi><tpages>8</tpages><oa>free_for_read</oa></addata></record> |
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| subjects | 36 Applied sciences Compression test DIFFRACTION DISLOCATIONS ELECTRON BEAMS ELECTROPLATING Exact sciences and technology FABRICATION INDIUM MECHANICAL PROPERTIES Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Metallic coatings Metals. Metallurgy MICROSTRUCTURE Plastic deformation Production techniques SHEAR STRESSES Surface treatment X-ray diffraction Yield phenomena |
| title | Fabrication, structure and mechanical properties of indium nanopillars |
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