Local, submicron, strain gradients as the cause of Sn whisker growth

Local, submicron, strain gradients as the cause of Sn whisker growth

It has been shown experimentally that local in-plane residual strain gradients occur around the root of spontaneously growing Sn whiskers on the surface of Sn coatings deposited on Cu. The strain distribution has been determined with synchrotron white beam micro Laue diffraction measurements. The ob...

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Veröffentlicht in:Applied physics letters 2009-06, Vol.94 (22), p.221901-221901-3
Hauptverfasser: Sobiech, M., Wohlschlögel, M., Welzel, U., Mittemeijer, E. J., Hügel, W., Seekamp, A., Liu, W., Ice, G. E.
Format: Artikel
Sprache:eng
Schlagworte:
COATINGS
COPPER
CRYSTAL GROWTH
DEPOSITION
DIFFRACTION
DISTRIBUTION
MATERIALS SCIENCE
PARTICLE ACCELERATORS
STRAINS
SYNCHROTRONS
TIN
WHISKERS
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Zusammenfassung:It has been shown experimentally that local in-plane residual strain gradients occur around the root of spontaneously growing Sn whiskers on the surface of Sn coatings deposited on Cu. The strain distribution has been determined with synchrotron white beam micro Laue diffraction measurements. The observed in-plane residual strain gradients in combination with recently revealed out-of-plane residual strain-depth gradients [ M. Sobiech , Appl. Phys. Lett. 93 , 011906 ( 2008 ) ] provide the driving forces for whisker growth.
ISSN:0003-6951
1077-3118
DOI:10.1063/1.3147864